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HGTD7N60C3S9A

Onsemi

HGTD7N60C3S9A by Onsemi

HGTD7N60C3S9A by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 2V and a max collector-emitter voltage of 600V. It is designed for power control applications, featuring a single configuration and surface mount capability. With a max power dissipation of 60W and operating temperature range from -40 to 150 °C, it offers efficient performance in various electronic systems.

Median Price

$1.488

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,483 parts In-Stock

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$2.650

100+ parts

$1.172

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$0.869

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1,483

$2.650

$1.172

$0.869

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Rochester

USA . 6,432 parts In-Stock

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-

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$1.430

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$1.190

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$1.060

6,432

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$1.430

$1.190

$1.060

Verical

USA . 5,939 parts In-Stock

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$1.488

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$1.325

5,939

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$1.488

$1.325

Distributors (In-Stock)

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Digiode

USA . 847 parts In-Stock

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$1.112

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$1.112

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Vyrian

USA . 1,434 parts In-Stock

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$1.170

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ComSIT Distribution GmbH

Germany . 67,816 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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Manotoh

Italy . 1,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,158 parts In-Stock

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$1.053

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1,158

$1.053

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Corohmni

South Africa . 207 parts In-Stock

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$1.170

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$1.170

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Component Stockers USA

USA . 2,835 parts In-Stock

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$1.200

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$1.130

1k+ parts

$0.850

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2,835

$1.200

$1.130

$0.850

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Native Components

USA . 642 parts In-Stock

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$1.715

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642

$1.715

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Northwest PG Solutions

USA . 1,130 parts In-Stock

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$1.887

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1,130

$1.887

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Andel Nordic

Denmark . 4,140 parts In-Stock

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$8.181

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$7.853

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$7.853

4,140

$8.181

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$7.853

$7.853

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,441 parts In-Stock

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SupplyDigital Components

Austria . 7,563 parts In-Stock

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ChipstoGo Electronic ltd

UK . 7,500 parts In-Stock

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TANS Electronics

Latvia . 6,130 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,634 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,756 parts In-Stock

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Kepictronics

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Problanco Electronics

Mexico . 2,375 parts In-Stock

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 555 parts In-Stock

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Kulean Microsystems

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Overview

Discover the power and reliability of the Onsemi HGTD7N60C3S9A Insulated Gate Bipolar Transistor (IGBT). With a maximum collector-emitter voltage of 600V and a maximum power dissipation of 60W, this N-CHANNEL transistor is ideal for high-power control applications. The single configuration and small outline package make it easy to integrate into your designs. Trust in Onsemi's reputation for quality and innovation, and experience the enhanced performance and efficiency that the HGTD7N60C3S9A brings to your projects. Upgrade your power control systems today with this cutting-edge IGBT!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher switching speeds compared to P-channel IGBTs, making them efficient for power control applications.

Configuration: SINGLE

Single configuration simplifies the design and integration process, making it easier to use in various power control applications.

Maximum VCEsat: 2 V

Low VCEsat ensures minimal power loss and high efficiency in power control operations.

Maximum Power Dissipation (Abs): 60 W

With a high power dissipation rating, this IGBT can handle high power levels without overheating.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating allows the IGBT to handle high voltage applications safely.

Maximum Gate-Emitter Voltage: 20 V

The gate-emitter voltage rating ensures safe and reliable operation of the IGBT in power control applications.

Maximum Turn Off Time (toff): 675 ns

The fast turn-off time helps in improving system efficiency and reducing switching losses in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) HGTD7N60C3S9A attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

275 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

675 ns

Nominal Turn Off Time (toff):

490 ns

Nominal Turn On Time (ton):

20 ns

Maximum VCEsat:

2 V

Trade Compliance

HGTD7N60C3S9A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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