Loading...

FW813

Onsemi

FW813 by Onsemi

FW813 by Onsemi is an N-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a Separate, 2-element configuration with built-in diode for SWITCHING applications. With a max IDM of 52A and 0.049 ohm RDS(on), it is ideal for high-power circuit designs in various industries.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,099 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

-

-

-

-

Digiode

USA . 943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

943

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 484 parts In-Stock

1+ parts

$1.272

100+ parts

-

1k+ parts

-

10k+ parts

-

484

$1.272

-

-

-

Northwest PG Solutions

USA . 1,467 parts In-Stock

1+ parts

$1.399

100+ parts

-

1k+ parts

-

10k+ parts

-

1,467

$1.399

-

-

-

TANS Electronics

Latvia . 8,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,143

-

-

-

-

Problanco Electronics

Mexico . 5,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,416

-

-

-

-

SupplyDigital Components

Austria . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

-

-

-

-

Kulean Microsystems

USA . 878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

878

-

-

-

-

Corphita

USA . 584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

584

-

-

-

-

Corohmni

South Africa . 191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

191

-

-

-

-

UHIMA Technologies

Türkiye . 137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

137

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the FW813 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers seamless switching capabilities for a wide range of applications. With its N-CHANNEL polarity and 2 elements with built-in diode configuration, the FW813 guarantees top-notch performance and reliability. Say goodbye to inefficiency and hello to optimized operations with this enhancement mode transistor. Experience the difference with Onsemi's commitment to quality and innovation in every element of the FW813.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher efficiency compared to P-channel FETs, making them a preferred choice in many applications.

Minimum DS Breakdown Voltage: 60 V

Suitable for applications requiring higher voltage handling capabilities, providing a reliable performance under varying conditions.

Maximum Pulsed Drain Current (IDM): 52 A

Capable of handling high current loads during pulsed operations, making it suitable for high-power applications.

Maximum Drain Current (ID): 5 A

Offers a high continuous drain current rating, allowing for stable and consistent operation.

Maximum Drain-Source On Resistance: 0.049 ohm

Low ON resistance results in reduced power loss and improved efficiency, making it suitable for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FW813 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.049 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

52 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FW813 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12