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FW811-TL-E

Onsemi

FW811-TL-E by Onsemi

FW811-TL-E by Onsemi is an N-CHANNEL Power FET with 8A max drain current and 2.2W power dissipation. It operates in enhancement mode, suitable for applications requiring high power efficiency at up to 150 °C. This surface-mount transistor features metal-oxide semiconductor technology and tin/bismuth terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 12,077 parts In-Stock

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Digiode

USA . 1,900 parts In-Stock

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Prism Electronics

USA . 20 parts In-Stock

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Native Components

USA . 414 parts In-Stock

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$1.788

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Northwest PG Solutions

USA . 229 parts In-Stock

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$1.967

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AZTECH Wire

Italy . 648 parts In-Stock

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$16.240

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QUARKTWIN TECHNOLOGY LTD

USA . 9,644 parts In-Stock

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TANS Electronics

Latvia . 6,658 parts In-Stock

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Kulean Microsystems

USA . 4,437 parts In-Stock

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SupplyDigital Components

Austria . 2,717 parts In-Stock

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Corphita

USA . 2,099 parts In-Stock

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Problanco Electronics

Mexico . 1,945 parts In-Stock

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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Corohmni

South Africa . 193 parts In-Stock

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Overview

Enhance your power management solutions with the FW811-TL-E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers exceptional quality and reliability in their Power Field Effect Transistors (FET). The N-CHANNEL design and ENHANCEMENT MODE operating mode make it versatile for a wide range of applications. With a maximum drain current of 8A and a maximum power dissipation of 2.2W, this FET offers exceptional performance in various scenarios. Trust Onsemi to provide cutting-edge technology and unmatched value with the FW811-TL-E.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used for applications requiring high efficiency and fast switching speeds, making this product suitable for power applications.

Surface Mount: YES

Surface mount packaging allows for easy and convenient installation on printed circuit boards, saving space and enabling compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the switching behavior, allowing for precise modulation of current flow and enhancing overall efficiency.

Maximum Drain Current (Abs) (ID): 8 A

With a high maximum drain current rating, this FET can handle heavy loads and deliver reliable performance in power applications.

Maximum Power Dissipation (Abs): 2.2 W

The low power dissipation rating ensures efficient operation and helps prevent overheating, ensuring long-term reliability of the device.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high input impedance, low noise, and fast switching speeds, making this FET suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, ensuring reliable operation in harsh environments.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and ensures secure connections, enhancing the overall reliability and longevity of the device.

Technical Specifications

Power Field Effect Transistors (FET) FW811-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

FW811-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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