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FW812-TL-E

Onsemi

FW812-TL-E by Onsemi

FW812-TL-E by Onsemi is an N-CHANNEL Power FET with 10A max drain current and 2.5W max power dissipation in enhancement mode. Utilizes metal-oxide semiconductor technology, operates up to 150 °C, and features surface mount design for various power applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,957 parts In-Stock

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Vyrian

USA . 778 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 332 parts In-Stock

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$99.990

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332

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QUARKTWIN TECHNOLOGY LTD

USA . 16,154 parts In-Stock

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Metaverse IC Inc.

Canada . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,467 parts In-Stock

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SupplyDigital Components

Austria . 5,582 parts In-Stock

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Kulean Microsystems

USA . 4,360 parts In-Stock

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Corphita

USA . 2,056 parts In-Stock

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Problanco Electronics

Mexico . 1,461 parts In-Stock

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Northwest PG Solutions

USA . 1,075 parts In-Stock

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$4.481

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UHIMA Technologies

Türkiye . 576 parts In-Stock

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576

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Native Components

USA . 95 parts In-Stock

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$4.435

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Corohmni

South Africa . 84 parts In-Stock

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Overview

Unleash the power of innovation with the FW812-TL-E by Onsemi. Crafted with precision and excellence, this N-CHANNEL Power Field Effect Transistor is designed to enhance performance in a variety of applications. From power management systems to industrial automation, this cutting-edge technology offers unparalleled reliability and efficiency. Experience peace of mind knowing that you're investing in a product that delivers quality, value, and exceptional results. Elevate your projects with the FW812-TL-E and stay ahead of the curve.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making them ideal for power management applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into circuit boards, saving space and reducing assembly costs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control over the flow of current, leading to improved performance and efficiency in various power applications.

Maximum Drain Current (ID): 10 A

With a high maximum drain current, this FET can handle substantial power loads, making it suitable for demanding industrial or automotive applications.

Maximum Power Dissipation: 2.5 W

The low power dissipation ensures that the FET operates efficiently and reliably without overheating, extending its lifespan.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability in a compact form factor, making it a popular choice for various power management applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to withstand harsh environmental conditions and maintain performance in demanding applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish offers good solderability and durability, ensuring secure connections and long-lasting performance in various operating environments.

Technical Specifications

Power Field Effect Transistors (FET) FW812-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

FW812-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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