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FW811

Onsemi

FW811 by Onsemi

FW811 by Onsemi is a N-CHANNEL Power FET with 8A max drain current and 2.2W power dissipation. It operates in enhancement mode, suitable for applications requiring high power efficiency at up to 150 °C. Ideal for surface mount configurations in various electronic devices.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,213 parts In-Stock

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Vyrian

USA . 91 parts In-Stock

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Native Components

USA . 215 parts In-Stock

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$1.788

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215

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Northwest PG Solutions

USA . 2,198 parts In-Stock

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$1.967

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Problanco Electronics

Mexico . 5,526 parts In-Stock

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SupplyDigital Components

Austria . 4,825 parts In-Stock

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TANS Electronics

Latvia . 3,238 parts In-Stock

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Kulean Microsystems

USA . 2,278 parts In-Stock

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Corphita

USA . 748 parts In-Stock

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UHIMA Technologies

Türkiye . 724 parts In-Stock

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Corohmni

South Africa . 487 parts In-Stock

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Overview

Upgrade your electronic devices with the FW811 by Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor (FET) that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this FET is perfect for a variety of applications where precision and efficiency are key. With a single configuration and enhancement mode operation, the FW811 provides a maximum drain current of 8A and a power dissipation of 2.2W, making it ideal for demanding projects. Trust Onsemi's expertise and elevate your designs with the FW811 today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high efficiency and fast switching speeds, making this product suitable for various power applications.

Configuration: SINGLE

Single configuration FETs are easier to control and integrate into circuits, offering simplicity and reliability in design.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, ideal for applications where size and weight are critical factors.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control over the flow of current, providing efficiency and precise power management capabilities.

Maximum Drain Current (Abs) (ID): 8 A

With a high maximum drain current capability of 8 A, this FET can handle moderate to high power requirements effectively.

Maximum Power Dissipation (Abs): 2.2 W

A maximum power dissipation of 2.2 W ensures that the FET can operate reliably without overheating or damage under specified conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers low leakage currents and high reliability, making this FET suitable for critical power applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperature environments, ensuring stable performance in various conditions.

Technical Specifications

Power Field Effect Transistors (FET) FW811 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

FW811 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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