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FW813TL

Onsemi

FW813TL by Onsemi

FW813TL by Onsemi is an N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 2 ELEMENTS WITH BUILT-IN DIODE in a PLASTIC/EPOXY package with GULL WING terminals. With a Max IDM of 52A and ID of 5A, this MOSFET has 0.049 ohm RDS(ON) and operates in ENHANCEMENT MODE.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,005 parts In-Stock

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1,005

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Digiode

USA . 836 parts In-Stock

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836

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Distributors (Availability)

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Native Components

USA . 605 parts In-Stock

1+ parts

$0.273

100+ parts

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$0.262

605

$0.273

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$0.262

Northwest PG Solutions

USA . 1,559 parts In-Stock

1+ parts

$0.300

100+ parts

-

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$0.265

1,559

$0.300

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$0.265

TANS Electronics

Latvia . 6,403 parts In-Stock

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6,403

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Kulean Microsystems

USA . 2,486 parts In-Stock

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2,486

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SupplyDigital Components

Austria . 1,233 parts In-Stock

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Corphita

USA . 1,209 parts In-Stock

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1,209

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UHIMA Technologies

Türkiye . 721 parts In-Stock

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721

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Problanco Electronics

Mexico . 439 parts In-Stock

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Corohmni

South Africa . 321 parts In-Stock

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Overview

Enhance your power management solutions with the FW813TL by Onsemi. Built with top-quality materials and advanced technology, this N-CHANNEL Power FET offers reliable performance in switching applications. With its separate configuration and built-in diode elements, this transistor provides seamless operation while maximizing efficiency. Whether you're looking to improve your system's performance or reduce energy consumption, the FW813TL delivers unmatched value and benefits. Trust Onsemi's reputation for excellence and take your projects to the next level with this innovative component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides a durable and lightweight housing for the FET, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance, higher transconductance, and better thermal stability compared to P-channel FETs, making this product a good choice for efficient switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having 2 separate elements with built-in diodes allows for more flexibility in circuit design and can provide additional protection against reverse voltage spikes, making this FET versatile and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low ON-resistance, enabling efficient and reliable operation in various electronic devices.

Surface Mount: YES

The surface-mount capability of this FET allows for easy and efficient PCB assembly, saving time and space in electronic designs.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage, this FET can handle higher voltages without risk of damage, providing a reliable solution for high-power applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement on a PCB and efficient use of space, making it ideal for compact electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and reliable connection to the PCB, ensuring stable operation and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily controlled and offer high input impedance, making them suitable for a wide range of applications including power management and signal processing.

No. of Elements: 2

Having 2 elements allows for more complex circuit configurations and provides redundancy in case one element fails, increasing the overall reliability of the FET.

Maximum Pulsed Drain Current (IDM): 52 A

With a high maximum pulsed drain current, this FET can handle short-term power surges and peak currents, making it ideal for applications with dynamic power requirements.

No. of Terminals: 8

Having 8 terminals provides more connections for external components and allows for greater flexibility in circuit design, making this FET versatile and adaptable to different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices, offering a good balance between size and performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high input impedance, low leakage current, and good thermal stability, making this product a reliable and efficient choice for various electronic applications.

Transistor Element Material: SILICON

Silicon FETs are known for their high performance, reliability, and durability, making this product a dependable choice for demanding electronic designs.

Maximum Drain Current (ID): 5 A

With a high maximum drain current rating, this FET can handle continuous current flow without overheating, ensuring reliable operation in various power management applications.

Maximum Drain-Source On Resistance: 0.049 ohm

The low ON-resistance of this FET results in minimal power loss and heat dissipation, making it efficient for switching applications and reducing overall energy consumption.

Terminal Position: DUAL

Having dual terminal positions allows for easy and secure connections to the PCB, providing stability and reliability in the circuit design.

Technical Specifications

Power Field Effect Transistors (FET) FW813TL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.049 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

52 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FW813TL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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