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FQP13N50C-F105

Onsemi

FQP13N50C-F105 by Onsemi

FQP13N50C-F105 by Onsemi is a N-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 52A and EAS of 860mJ, operating in ENHANCEMENT MODE. The transistor has a RECTANGULAR package shape with THROUGH-HOLE terminals, suitable for high-power FLANGE MOUNT designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,400 parts In-Stock

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7,400

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Digiode

USA . 1,497 parts In-Stock

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1,497

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Nova Conductors

Japan . 581 parts In-Stock

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581

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AZTECH Wire

Italy . 710 parts In-Stock

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$7.767

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710

$7.767

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Ampacity Inc.

Singapore . 2,350 parts In-Stock

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$15.050

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2,350

$15.050

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Continental Prestige Electronics

USA . 12,153 parts In-Stock

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SupplyDigital Components

Austria . 8,270 parts In-Stock

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TANS Electronics

Latvia . 7,629 parts In-Stock

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7,629

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Problanco Electronics

Mexico . 7,596 parts In-Stock

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Argo Parts USA

USA . 5,954 parts In-Stock

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Kulean Microsystems

USA . 4,259 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Supply Digital

USA . 2,534 parts In-Stock

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Corphita

USA . 1,964 parts In-Stock

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UHIMA Technologies

Türkiye . 654 parts In-Stock

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Corohmni

South Africa . 314 parts In-Stock

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Bastille Electronics

Australia . 215 parts In-Stock

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Overview

Enhance your electronic devices with the FQP13N50C-F105 by Onsemi, a high-quality Power FET that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this N-CHANNEL transistor is ideal for switching applications. With a 500V DS Breakdown Voltage and 52A Pulsed Drain Current, it provides efficient power management. The FQP13N50C-F105 also features a built-in diode for added convenience. Upgrade your products with this advanced semiconductor technology and experience the superior benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making this product a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and protects the FET from voltage spikes, making it a convenient and reliable choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low on-state resistance, making it an efficient choice for power control.

Minimum DS Breakdown Voltage: 500 V

With a high minimum breakdown voltage, this FET can handle high voltage applications with ease, providing a reliable solution for power switching.

Package Shape: RECTANGULAR

The rectangular package allows for easy mounting and installation, making it convenient for integration into various electronic systems.

Terminal Form: THROUGH-HOLE

The through-hole terminals facilitate easy and secure connections, ensuring reliable performance in different circuit environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer improved control and efficiency in switching applications, making this product a suitable choice for power management.

Maximum Pulsed Drain Current (IDM): 52 A

With a high pulsed drain current rating, this FET can handle high current spikes effectively, making it reliable for demanding switching operations.

Avalanche Energy Rating (EAS): 860 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage surges, ensuring reliable operation in harsh conditions.

No. of Terminals: 3

Having 3 terminals enables easy interfacing with external components, simplifying the circuit design and enhancing the overall system efficiency.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting options, ensuring stability and thermal performance in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides enhanced performance and reliability, making this FET a reliable choice for power switching applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making this product a durable and efficient choice for power control applications.

Terminal Finish: MATTE TIN

Matte tin finish on the terminals ensures good solderability and conductivity, improving the overall performance and reliability of the FET.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures consistency in connections, enhancing the overall reliability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) FQP13N50C-F105 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

860 mJ

Minimum DS Breakdown Voltage:

500 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

52 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP13N50C-F105 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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