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FQP12P10

Onsemi

FQP12P10 by Onsemi

FQP12P10 by Onsemi is a P-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 46A and EAS of 370mJ, suitable for high-power operations. With a max power dissipation of 75W and operating temperature up to 175 °C, it offers reliable performance in various industrial settings.

Median Price

$0.620

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

-

100+ parts

$0.620

1k+ parts

$0.514

10k+ parts

$0.458

19

-

$0.620

$0.514

$0.458

Distributors (In-Stock)

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Digiode

USA . 2,352 parts In-Stock

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$0.698

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2,352

$0.698

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Vyrian

USA . 8,971 parts In-Stock

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Flip Electronics

USA . 4,000 parts In-Stock

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Chip Stock

USA . 3,145 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 320 parts In-Stock

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,812 parts In-Stock

1+ parts

$0.662

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2,812

$0.662

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Corohmni

South Africa . 342 parts In-Stock

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$0.735

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342

$0.735

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Andel Nordic

Denmark . 416 parts In-Stock

1+ parts

$1.505

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$1.444

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$1.444

416

$1.505

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$1.444

$1.444

Native Components

USA . 164 parts In-Stock

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$10.372

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164

$10.372

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Northwest PG Solutions

USA . 1,938 parts In-Stock

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$11.409

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$10.268

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$10.268

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TANS Electronics

Latvia . 8,088 parts In-Stock

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Kulean Microsystems

USA . 6,976 parts In-Stock

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SupplyDigital Components

Austria . 5,326 parts In-Stock

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Problanco Electronics

Mexico . 4,517 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,600 parts In-Stock

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2,600

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Alle Elektronik GmbH

Germany . 1,733 parts In-Stock

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GreenTree Electronics

Israel . 1,100 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Supply Digital

USA . 950 parts In-Stock

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950

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UHIMA Technologies

Türkiye . 49 parts In-Stock

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Overview

Experience the power of innovation with the FQP12P10 by Onsemi. Crafted with precision and quality, this P-Channel Power Field Effect Transistor (FET) offers seamless switching capabilities for a wide range of applications. From enhancing efficiency to optimizing performance, this single transistor with built-in diode delivers exceptional value and reliability. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the FQP12P10. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

Ideal for certain types of circuit design and applications that require P-channel transistors.

Minimum DS Breakdown Voltage: 100 V

Suitable for high voltage applications, providing a good margin of safety.

Maximum Pulsed Drain Current (IDM): 46 A

Can handle high current pulses which makes it suitable for applications that require quick switching.

Maximum Power Dissipation (Abs): 75 W

Ability to dissipate high power levels can prevent overheating and ensure stable operation.

Maximum Operating Temperature: 175 °C

Can withstand high temperatures, allowing it to be used in a variety of environments.

Maximum Drain-Source On Resistance: 0.29 ohm

Low on-resistance results in less power loss and better efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FQP12P10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

370 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

11.5 A

Maximum Drain Current (ID):

11.5 A

Maximum Drain-Source On Resistance:

.29 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

46 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP12P10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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