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FQP12P20

Onsemi

FQP12P20 by Onsemi

FQP12P20 by Onsemi is a P-CHANNEL Power FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 46A and EAS of 810mJ, operating in ENHANCEMENT MODE. The transistor has a max power dissipation of 120W and an RDS(on) of 0.47 ohm, suitable for high-power circuit designs.

Median Price

$1.210

Lifecycle Status

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12

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1k+

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Rochester

USA . 119 parts In-Stock

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$1.210

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$1.140

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$1.030

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119

$1.210

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Nova Conductors

Japan . 26 parts In-Stock

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Digiode

USA . 1,838 parts In-Stock

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Vyrian

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Flip Electronics

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Prism Electronics

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Fibra_Brandt Electronic GMBH

Germany . 80 parts In-Stock

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ComSIT Distribution GmbH

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Mil-Aero Solutions, Inc.

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LittleDiode

UK . 3 parts In-Stock

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LWI Electronics Inc

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Modulus Dynamics

Lithuania . 3,221 parts In-Stock

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$0.937

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$0.937

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$0.937

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Ampacity Inc.

Singapore . 119 parts In-Stock

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$1.030

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Corohmni

South Africa . 53 parts In-Stock

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$1.085

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Corphita

USA . 1,631 parts In-Stock

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$1.089

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Netroflash

USA . 2,000 parts In-Stock

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$1.107

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$1.052

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Aztec Data Supply Inc.

USA . 2,072 parts In-Stock

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$1.170

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AZTECH Wire

Italy . 502 parts In-Stock

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$11.332

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Microchip USA

USA . 451 parts In-Stock

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$16.575

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Lixinc

USA . 12,257 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,165 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

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Continental Prestige Electronics

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Glotronic Ltd.

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Alle Elektronik GmbH

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Problanco Electronics

Mexico . 2,312 parts In-Stock

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Supply Digital

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Argo Parts USA

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TANS Electronics

Latvia . 1,359 parts In-Stock

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GreenTree Electronics

Israel . 910 parts In-Stock

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UHIMA Technologies

Türkiye . 228 parts In-Stock

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iodParts Technologies Inc.

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Overview

Unlock the power of innovation with the FQP12P20 by Onsemi, a cutting-edge P-Channel Power Field Effect Transistor designed for high-performance switching applications. Manufactured by industry leader Onsemi, this transistor boasts unparalleled quality and reliability. With a maximum drain current of 11.5 A and an impressive power dissipation of 120 W, this transistor offers unmatched efficiency and durability. Ideal for a wide range of industrial and automotive applications, the FQP12P20 delivers exceptional value and performance, making it the perfect choice for your next project. Elevate your designs with Onsemi's FQP12P20 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of environments.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high current capability, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, adding an extra layer of reliability to the transistor.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this transistor can handle high voltage applications with ease.

Maximum Drain Current (ID): 11.5 A

Capable of handling high currents, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 120 W

With a high power dissipation rating, this transistor can handle high power applications without overheating.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, allowing for use in a wide range of environments.

Technical Specifications

Power Field Effect Transistors (FET) FQP12P20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

810 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

11.5 A

Maximum Drain Current (ID):

11.5 A

Maximum Drain-Source On Resistance:

.47 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

46 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP12P20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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