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FQP10N60C

Onsemi

FQP10N60C by Onsemi

FQP10N60C by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 38A IDM. Ideal for SWITCHING applications, it features a 0.73 ohm Drain-Source On Resistance and operates in ENHANCEMENT MODE. With a max operating temperature of 150°C, this transistor is suitable for various power control systems.

Median Price

$1.414

Lifecycle Status

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1k+

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Rochester

USA . 244 parts In-Stock

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$1.390

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$1.150

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$1.030

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Verical

USA . 244 parts In-Stock

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$1.438

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$1.288

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Nova Conductors

Japan . 50 parts In-Stock

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$1.029

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Digiode

USA . 2,174 parts In-Stock

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Vyrian

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J2 Sourcing AB

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Chip Stock

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PC Components Company LLC

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Bristol Electronics

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Euro-Tech

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 17 parts In-Stock

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Ampacity Inc.

Singapore . 217 parts In-Stock

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$0.970

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Corohmni

South Africa . 225 parts In-Stock

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$0.988

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Corphita

USA . 536 parts In-Stock

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$1.026

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Continental Prestige Electronics

USA . 6,240 parts In-Stock

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$1.008

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Argo Parts USA

USA . 2,112 parts In-Stock

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Andel Nordic

Denmark . 341 parts In-Stock

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$1.149

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$1.103

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Microchip USA

USA . 232 parts In-Stock

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$7.085

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AZTECH Wire

Italy . 617 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Problanco Electronics

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TANS Electronics

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Kulean Microsystems

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Glotronic Ltd.

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SupplyDigital Components

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Supply Digital

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Netroflash

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 944 parts In-Stock

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Overview

Unlock the power of innovation with the FQP10N60C Power Field Effect Transistor by Onsemi. Known for their top-notch quality and cutting-edge technology, Onsemi delivers a product that exceeds expectations. This N-channel transistor is perfect for switching applications, offering a high breakdown voltage of 600V and a maximum drain current of 9.5A. With its single configuration and built-in diode, this transistor provides unmatched efficiency and reliability. Trust Onsemi to provide you with a solution that meets your needs and propels your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower ON-resistance and higher conductivity, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications safely and reliably.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against voltage spikes, making this FET suitable for various switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient control over power flow in electronic circuits.

Maximum Pulsed Drain Current (IDM): 38 A

The high pulsed drain current rating allows this FET to handle sudden spikes in current without damage, ensuring reliability in demanding situations.

Avalanche Energy Rating (EAS): 700 mJ

With a high avalanche energy rating, this FET can withstand voltage transients and surges, making it ideal for robust and reliable operation in harsh environments.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate efficiently in a wide range of temperature conditions, increasing its versatility.

Maximum Drain-Source On Resistance: 0.73 ohm

The low ON-resistance helps minimize power losses and improves efficiency in switching applications, making this FET a cost-effective choice.

Technical Specifications

Power Field Effect Transistors (FET) FQP10N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

700 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

9.5 A

Maximum Drain-Source On Resistance:

.73 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

38 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP10N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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