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FQP13N50

Onsemi

FQP13N50 by Onsemi

FQP13N50 by Onsemi is a Power FET with 500V DS breakdown voltage, 12.5A max drain current, and 0.43 ohm RDS(on). It's an N-channel transistor for switching applications in enhancement mode. The device comes in a plastic/epoxy package with a built-in diode, suitable for high-power operations up to 170W at 150°C.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38 parts In-Stock

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-

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$1.410

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$1.170

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$1.040

38

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$1.410

$1.170

$1.040

Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

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$0.920

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$0.920

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Digiode

USA . 1,196 parts In-Stock

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$1.264

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$1.264

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Chip Stock

USA . 9,500 parts In-Stock

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Vyrian

USA . 6,948 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Holdelec - ElecDif-Pro

France . 50 parts In-Stock

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Micros

Poland . 47 parts In-Stock

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$1.765

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$1.728

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47

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$1.765

$1.728

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Partservice

France . 47 parts In-Stock

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$1.767

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$1.730

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$1.730

47

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$1.767

$1.730

$1.730

Micros sp.j. W. Kędra i J. Lic

Poland . 47 parts In-Stock

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$1.893

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$1.853

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$1.853

47

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$1.853

$1.853

LWI Electronics Inc

India . 36 parts In-Stock

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LittleDiode

UK . 11 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 606 parts In-Stock

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$0.344

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$0.344

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Corohmni

South Africa . 308 parts In-Stock

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$0.902

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308

$0.902

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Continental Prestige Electronics

USA . 3,984 parts In-Stock

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$0.920

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$0.902

3,984

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Argo Parts USA

USA . 2,500 parts In-Stock

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$0.920

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$0.920

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Netroflash

USA . 100 parts In-Stock

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$0.920

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$0.920

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Ampacity Inc.

Singapore . 38 parts In-Stock

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$1.130

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$1.130

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Corphita

USA . 1,433 parts In-Stock

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$1.197

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$1.197

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Andel Nordic

Denmark . 134 parts In-Stock

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$2.472

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$2.373

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$2.373

134

$2.472

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$2.373

AZTECH Wire

Italy . 734 parts In-Stock

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$14.999

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734

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,329 parts In-Stock

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Kepictronics

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Perfect Parts

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Kulean Microsystems

USA . 7,447 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,296 parts In-Stock

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TANS Electronics

Latvia . 5,816 parts In-Stock

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SupplyDigital Components

Austria . 4,441 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,197 parts In-Stock

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RC Electronics

USA . 3,780 parts In-Stock

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$1.160

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$1.090

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$1.070

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Problanco Electronics

Mexico . 2,677 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 545 parts In-Stock

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Microchip USA

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iodParts Technologies Inc.

India . 60 parts In-Stock

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Overview

Experience superior performance and reliability with the FQP13N50 by Onsemi, a leading manufacturer in the field of Power Field Effect Transistors (FET). This N-CHANNEL transistor offers a single configuration with a built-in diode, making it ideal for switching applications. With a minimum DS breakdown voltage of 500V and a maximum power dissipation of 170W, this transistor is designed to handle high-power tasks with ease. Whether you're looking to optimize your industrial equipment or enhance your electronic devices, the FQP13N50 provides the value, efficiency, and durability you need to succeed. Upgrade to Onsemi today and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and heat dissipation, making the product durable and reliable.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and saves space, making installation easier.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this product can handle high power applications effectively.

Transistor Application: SWITCHING

Ideal for switching applications, allowing for efficient control of power flow.

Maximum Pulsed Drain Current (IDM): 50 A

High pulsed drain current capability enables the product to handle sudden power surges effectively.

Maximum Power Dissipation (Abs): 170 W

With a high power dissipation rating, this product can operate under heavy loads without overheating.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures, ensuring reliable performance even in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) FQP13N50 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

810 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

12.5 A

Maximum Drain Current (ID):

12.5 A

Maximum Drain-Source On Resistance:

.43 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP13N50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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