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FQB8N90CTM

Onsemi

FQB8N90CTM by Onsemi

FQB8N90CTM by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 25A and EAS of 850mJ, suitable for high-power operations. With a compact SMALL OUTLINE package and ENHANCEMENT MODE operation, it offers efficient performance in various electronic designs.

Median Price

$2.555

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 710 parts In-Stock

1+ parts

$1.450

100+ parts

$1.360

1k+ parts

$1.230

10k+ parts

$1.230

710

$1.450

$1.360

$1.230

$1.230

Mouser Electronics

USA . 686 parts In-Stock

1+ parts

$3.660

100+ parts

$1.870

1k+ parts

$1.570

10k+ parts

-

686

$3.660

$1.870

$1.570

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Flip Electronics (Authorized)

USA . 9,600 parts In-Stock

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9,600

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Distributors (In-Stock)

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Digiode

USA . 523 parts In-Stock

1+ parts

$1.378

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-

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523

$1.378

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Vyrian

USA . 771 parts In-Stock

1+ parts

$1.450

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771

$1.450

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Flip Electronics

USA . 75,200 parts In-Stock

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75,200

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Distributors (Availability)

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Corphita

USA . 1,664 parts In-Stock

1+ parts

$1.305

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-

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1,664

$1.305

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Corohmni

South Africa . 191 parts In-Stock

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$1.450

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191

$1.450

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Component Stockers USA

USA . 6,670 parts In-Stock

1+ parts

$21.100

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6,670

$21.100

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Problanco Electronics

Mexico . 8,066 parts In-Stock

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8,066

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Kepictronics

USA . 6,800 parts In-Stock

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6,800

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Alle Elektronik GmbH

Germany . 4,696 parts In-Stock

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4,696

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Kulean Microsystems

USA . 2,985 parts In-Stock

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2,985

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SupplyDigital Components

Austria . 2,877 parts In-Stock

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TANS Electronics

Latvia . 2,566 parts In-Stock

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Perfect Parts

USA . 1,792 parts In-Stock

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Supply Digital

USA . 1,362 parts In-Stock

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1,362

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Native Components

USA . 755 parts In-Stock

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$3.372

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755

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$3.372

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UHIMA Technologies

Türkiye . 738 parts In-Stock

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738

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Northwest PG Solutions

USA . 678 parts In-Stock

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$3.406

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678

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$3.406

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Overview

Upgrade your power control with the FQB8N90CTM from Onsemi. Designed with precision and reliability in mind, this Power FET offers unparalleled performance in switching applications. With a built-in diode and a high breakdown voltage of 900V, this N-channel transistor ensures efficient operation even under demanding conditions. Say goodbye to power inefficiencies and hello to optimized performance with the FQB8N90CTM. Elevate your projects with the quality and value that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: Plastic/Epoxy

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-Channel

N-Channel FETs typically have better performance and efficiency compared to P-Channel FETs, making this product a good choice for various applications.

Configuration: Single with Built-in Diode

The built-in diode allows for efficient switching and protection against reverse currents, enhancing the overall functionality of the transistor.

Transistor Application: Switching

Designed specifically for switching applications, ensuring reliable performance when turning circuits on and off.

Operating Mode: Enhancement Mode

Enhancement mode FETs offer better control and efficiency in operation, making this product ideal for demanding applications.

Maximum Power Dissipation (Abs): 171 W

Has a high power dissipation rating, suitable for applications requiring high power handling capabilities.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures without compromising performance, making it reliable in various environmental conditions.

Maximum Drain-Source On Resistance: 1.9 ohm

Low on-resistance allows for minimal power loss and higher efficiency in circuit operation.

Technical Specifications

Power Field Effect Transistors (FET) FQB8N90CTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

850 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

6.3 A

Maximum Drain Current (ID):

6.3 A

Maximum Drain-Source On Resistance:

1.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB8N90CTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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