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FQB5N90TM

Onsemi

FQB5N90TM by Onsemi

FQB5N90TM by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 21.6A and EAS of 660mJ, operating in ENHANCEMENT MODE at up to 150°C. This PLASTIC/EPOXY transistor has GULL WING terminals and a DRAIN connection, suitable for high-power circuits requiring efficient switching capabilities.

Median Price

$1.538

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 12,670 parts In-Stock

1+ parts

$3.150

100+ parts

$1.750

1k+ parts

$1.580

10k+ parts

-

12,670

$3.150

$1.750

$1.580

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Element14

Singapore . 9,530 parts In-Stock

1+ parts

$3.290

100+ parts

$2.500

1k+ parts

$1.690

10k+ parts

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9,530

$3.290

$2.500

$1.690

-

DigiKey

USA . 575 parts In-Stock

1+ parts

$4.030

100+ parts

$1.863

1k+ parts

$1.452

10k+ parts

$1.369

575

$4.030

$1.863

$1.452

$1.369

Chip1Stop

Japan . 18,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.530

10k+ parts

$1.470

18,400

-

-

$1.530

$1.470

Arrow

USA . 15,200 parts In-Stock

1+ parts

-

100+ parts

-

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$1.360

10k+ parts

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15,200

-

-

$1.360

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Rochester

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

$1.380

1k+ parts

$1.230

10k+ parts

$1.160

2,400

-

$1.380

$1.230

$1.160

Verical

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

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$1.538

10k+ parts

$1.450

1,600

-

-

$1.538

$1.450

Flip Electronics (Authorized)

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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800

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.373

100+ parts

-

1k+ parts

-

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50

$1.373

-

-

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Digiode

USA . 1,752 parts In-Stock

1+ parts

$2.384

100+ parts

-

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1,752

$2.384

-

-

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Maritex

Poland . 629 parts In-Stock

1+ parts

$2.687

100+ parts

$1.575

1k+ parts

$1.304

10k+ parts

-

629

$2.687

$1.575

$1.304

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TME

Poland . 709 parts In-Stock

1+ parts

$2.960

100+ parts

$1.870

1k+ parts

$1.770

10k+ parts

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709

$2.960

$1.870

$1.770

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Vyrian

USA . 11,054 parts In-Stock

1+ parts

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11,054

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Chip Stock

USA . 9,500 parts In-Stock

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9,500

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Flip Electronics

USA . 800 parts In-Stock

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800

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ComSIT Distribution GmbH

Germany . 531 parts In-Stock

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531

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$0.810

100+ parts

-

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10k+ parts

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1,000

$0.810

-

-

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Semicontronic

India . 10,940 parts In-Stock

1+ parts

$1.170

100+ parts

$1.141

1k+ parts

$1.135

10k+ parts

-

10,940

$1.170

$1.141

$1.135

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Ampacity Inc.

Singapore . 10,869 parts In-Stock

1+ parts

$1.170

100+ parts

-

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10,869

$1.170

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Corohmni

South Africa . 273 parts In-Stock

1+ parts

$1.319

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273

$1.319

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$1.346

100+ parts

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1k+ parts

$1.292

10k+ parts

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1,000

$1.346

-

$1.292

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Argo Parts USA

USA . 3,438 parts In-Stock

1+ parts

$1.373

100+ parts

-

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3,438

$1.373

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Continental Prestige Electronics

USA . 50 parts In-Stock

1+ parts

$1.373

100+ parts

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10k+ parts

$1.346

50

$1.373

-

-

$1.346

Corphita

USA . 2,601 parts In-Stock

1+ parts

$2.259

100+ parts

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2,601

$2.259

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Andel Nordic

Denmark . 335 parts In-Stock

1+ parts

$9.641

100+ parts

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1k+ parts

$9.255

10k+ parts

$9.255

335

$9.641

-

$9.255

$9.255

Microchip USA

USA . 2,873 parts In-Stock

1+ parts

$10.742

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2,873

$10.742

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Perfect Parts

USA . 44,968 parts In-Stock

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44,968

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RC Electronics

USA . 32,711 parts In-Stock

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32,711

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Authorized Procurement Solutions

USA . 10,400 parts In-Stock

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10,400

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TANS Electronics

Latvia . 5,886 parts In-Stock

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5,886

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SupplyDigital Components

Austria . 5,693 parts In-Stock

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5,693

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Kepictronics

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 3,844 parts In-Stock

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3,844

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Kulean Microsystems

USA . 3,630 parts In-Stock

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3,630

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Supply Digital

USA . 2,779 parts In-Stock

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2,779

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iodParts Technologies Inc.

India . 2,615 parts In-Stock

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2,615

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GreenTree Electronics

Israel . 2,400 parts In-Stock

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2,400

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Lixinc

USA . 1,415 parts In-Stock

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1,415

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UHIMA Technologies

Türkiye . 60 parts In-Stock

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60

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Overview

Experience the superior performance and reliability of the FQB5N90TM Power Field Effect Transistor by Onsemi. This N-CHANNEL transistor, with a single configuration and built-in diode, is perfect for switching applications. With a high minimum DS Breakdown Voltage of 900V and maximum power dissipation of 158W, this transistor can handle even the most demanding tasks with ease. Trust in Onsemi's reputation for quality and innovation, and unlock the potential of your projects with the FQB5N90TM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy packaging provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in most electronic applications due to their high performance and efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in protecting the circuit by preventing reverse current flow, enhancing the reliability of the device.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in circuits that require frequent switching.

Surface Mount: YES

Surface-mount package allows for easy and convenient integration onto PCBs, saving space and simplifying assembly process.

Minimum DS Breakdown Voltage: 900 V

High breakdown voltage ensures that the transistor can withstand high voltages, making it suitable for high-power applications.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, allowing for efficient use of space on the PCB.

Maximum Pulsed Drain Current (IDM): 21.6 A

High maximum pulsed drain current rating allows the transistor to handle high current pulses, making it ideal for demanding applications.

Avalanche Energy Rating (EAS): 660 mJ

High avalanche energy rating indicates the transistor's ability to withstand high energy spikes, improving overall reliability.

Maximum Drain Current (Abs) (ID): 5.4 A

High maximum drain current rating ensures the transistor can handle continuous current flow without overheating.

Maximum Power Dissipation (Abs): 158 W

High power dissipation rating allows the transistor to handle high power levels, ensuring reliable performance in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and efficiency, making the transistor suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures the transistor can operate in extreme conditions without losing performance.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in a variety of environments.

Maximum Drain-Source On Resistance: 2.3 ohm

Low on-resistance results in minimal power loss and high efficiency, making the transistor suitable for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FQB5N90TM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

660 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

5.4 A

Maximum Drain Current (ID):

5.4 A

Maximum Drain-Source On Resistance:

2.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

21.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB5N90TM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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