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FQB5N60CTM_WS

Onsemi

FQB5N60CTM_WS by Onsemi

FQB5N60CTM_WS by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 18A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 100W and can handle up to 4.5A ID current.

Median Price

$1.502

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 760 parts In-Stock

1+ parts

$2.220

100+ parts

$0.968

1k+ parts

-

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760

$2.220

$0.968

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Flip Electronics (Authorized)

USA . 33,600 parts In-Stock

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33,600

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Mouser Electronics

USA . 257 parts In-Stock

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-

100+ parts

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$0.783

10k+ parts

$0.664

257

-

-

$0.783

$0.664

Distributors (In-Stock)

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Digiode

USA . 2,390 parts In-Stock

1+ parts

$1.767

100+ parts

-

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2,390

$1.767

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Flip Electronics

USA . 33,600 parts In-Stock

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33,600

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Vyrian

USA . 11,047 parts In-Stock

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11,047

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,105 parts In-Stock

1+ parts

$0.670

100+ parts

-

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11,105

$0.670

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Corohmni

South Africa . 440 parts In-Stock

1+ parts

$0.783

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440

$0.783

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Aztec Data Supply Inc.

USA . 2,972 parts In-Stock

1+ parts

$0.820

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2,972

$0.820

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Component Stockers USA

USA . 483 parts In-Stock

1+ parts

$1.470

100+ parts

$0.970

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483

$1.470

$0.970

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Corphita

USA . 769 parts In-Stock

1+ parts

$1.674

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769

$1.674

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TANS Electronics

Latvia . 8,399 parts In-Stock

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8,399

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Problanco Electronics

Mexico . 4,702 parts In-Stock

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4,702

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Argo Parts USA

USA . 4,190 parts In-Stock

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Continental Prestige Electronics

USA . 2,385 parts In-Stock

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2,385

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SupplyDigital Components

Austria . 2,036 parts In-Stock

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2,036

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Kepictronics

USA . 800 parts In-Stock

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800

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Kulean Microsystems

USA . 337 parts In-Stock

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337

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Microchip USA

USA . 334 parts In-Stock

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334

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UHIMA Technologies

Türkiye . 87 parts In-Stock

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87

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your power switching applications with the FQB5N60CTM_WS by Onsemi, a top-tier manufacturer known for delivering high-quality Power Field Effect Transistors. This N-CHANNEL transistor with a built-in diode offers customers unparalleled value and benefits, including a maximum DS Breakdown Voltage of 600V and an Avalanche Energy Rating of 210mJ. Perfect for various switching applications, this transistor operates in enhancement mode and boasts a compact rectangular package shape for easy installation. Trust Onsemi to provide reliable and efficient solutions for your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation and protection for the internal components of the FET.

Minimum DS Breakdown Voltage: 600 V

High breakdown voltage ensures reliable performance and protection against voltage spikes or surges in switching applications.

Maximum Pulsed Drain Current (IDM): 18 A

High pulsed drain current capability allows the FET to handle sudden surge currents effectively.

Maximum Power Dissipation (Abs): 100 W

High power dissipation rating enables the FET to handle higher power applications without overheating.

Maximum Operating Temperature: 150 °C

Wide operating temperature range allows the FET to be used in a variety of environments and applications.

Maximum Drain-Source On Resistance: 2.5 ohm

Low on-resistance minimizes power losses and increases efficiency in switching operations.

Technical Specifications

Power Field Effect Transistors (FET) FQB5N60CTM_WS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

210 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

8.5 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

185 ns

Maximum Turn On Time (ton):

120 ns

Trade Compliance

FQB5N60CTM_WS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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