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FQB5N60C

Fairchild Semiconductor

FQB5N60C by Fairchild Semiconductor

FQB5N60C by Fairchild Semiconductor is a power field effect transistor (FET) with a min DS breakdown voltage of 600V. It is an N-channel transistor with a max pulsed drain current of 18A and a max power dissipation of 100W. This transistor is commonly used for switching applications.

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Overview

Discover the power of the FQB5N60C from Fairchild Semiconductor, a leading manufacturer in the industry. This high-quality Power Field Effect Transistor (FET) offers exceptional performance and reliability for a wide range of applications. With its N-CHANNEL polarity and built-in diode, it is perfect for switching applications. Its compact and durable design, along with its surface mount capability, makes it easy to integrate into your projects. Experience the benefits of this FET's 600 V minimum DS breakdown voltage, 18 A maximum pulsed drain current, and 100 W maximum power dissipation. Trust in Fairchild Semiconductor for innovative solutions that deliver value and unmatched performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides excellent protection from external elements and ensures durability, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

With its N-channel polarity or channel type, this power field effect transistor offers efficient and reliable performance in switching applications, making it suitable for a wide range of electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration of this power FET, combined with a built-in diode, enhances convenience and simplifies circuit design, making it an ideal choice for efficient switch operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET ensures fast and efficient switching operations, making it an optimal choice for devices that require quick response times.

Surface Mount: YES

With its surface mount capability, this power FET offers easy and convenient integration onto PCBs, saving space and simplifying assembly processes, making it a practical choice for modern electronic designs.

Minimum DS Breakdown Voltage: 600 V

This power FET's minimum DS (Drain-Source) breakdown voltage of 600 V ensures reliable operation and protection against voltage spikes, making it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape of this power FET provides compatibility with standard PCB layouts and allows for efficient use of space, making it a versatile choice for various electronic designs.

Terminal Form: GULL WING

The gull wing terminal form of this power FET enables easy and secure soldering onto PCBs, ensuring reliable electrical connections, making it a practical choice for production and assembly processes.

Operating Mode: ENHANCEMENT MODE

With its enhancement mode operating mode, this power FET offers easy and precise control over switching operations, providing enhanced efficiency and performance.

No. of Elements: 1

This power FET consists of a single element, simplifying circuit design and reducing component count, making it an efficient and cost-effective choice for various applications.

Maximum Pulsed Drain Current (IDM): 18 A

With a maximum pulsed drain current of 18 A, this power FET can handle high-current applications reliably, making it suitable for demanding switch operations.

Avalanche Energy Rating (EAS): 210 mJ

This power FET's high avalanche energy rating of 210 mJ enables it to withstand energy surges and improves overall robustness, providing added protection in rugged environments.

Maximum Drain Current (Abs) (ID): 4.5 A

With a maximum drain current of 4.5 A, this power FET offers ample current handling capacity for various applications, ensuring stable and reliable operation.

No. of Terminals: 2

With two terminals, this power FET provides a simple and straightforward connection interface, making it easy to integrate into circuit designs and reducing wiring complexity.

Maximum Power Dissipation (Abs): 100 W

This power FET's maximum power dissipation of 100 W ensures efficient heat dissipation, allowing for continuous and reliable operation even under demanding conditions.

Package Style (Meter): SMALL OUTLINE

With its small outline package style, this power FET offers compactness and space-saving benefits, making it suitable for applications with tight size constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this power FET delivers excellent electrical performance, reliability, and low power consumption, making it an optimal choice for energy-efficient designs.

Maximum Operating Temperature: 150 °C

Designed to withstand high temperatures, this power FET ensures reliable operation even in challenging environments, making it suitable for applications where temperature fluctuations occur.

Transistor Element Material: SILICON

Built with silicon as the transistor element material, this power FET offers excellent thermal stability and high performance, ensuring long-term reliability and suitable for various demanding applications.

Maximum Drain-Source On Resistance: 2.5 ohm

With a maximum drain-source on resistance of 2.5 ohm, this power FET minimizes voltage drops and power losses, improving overall efficiency and performance in circuit designs.

Terminal Position: SINGLE

The single terminal position of this power FET allows for easy and standardized connections, simplifying circuit designs and facilitating seamless integration into various electronic systems.

Case Connection: DRAIN

The drain case connection of this power FET provides a low resistance path for current flow, ensuring efficient operation and minimizing power losses, making it an excellent choice for power-related applications.

Technical Specifications

Power Field Effect Transistors (FET) FQB5N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Fairchild Semiconductor

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

210 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

2.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB5N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Fairchild Semiconductor

In 2016 Fairchild was acquired by ON Semiconductor (after 2022, onsemi). Fairchild Semiconductor International, Inc. was an American semiconductor company based in San Jose, California. Founded in 1957 as a division of Fairchild Camera and Instrument, it became a pioneer in the manufacturing of transistors and of integrated circuits. Schlumberger bought the firm in 1979 and sold it to National Semiconductor in 1987; Fairchild was spun off as an independent company again in 1997. In September 2016, Fairchild was acquired by ON Semiconductor. The company had locations in the United States at San Jose, California; San Rafael, California; South Portland, Maine; West Jordan, Utah; and Mountaintop, Pennsylvania. Outside the US it operated locations in Australia;[4] Singapore; Bucheon, South Korea; Penang, Malaysia; Suzhou, China; and Cebu, Philippines, among others.

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