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FQB27N25TM-F085

Onsemi

FQB27N25TM-F085 by Onsemi

FQB27N25TM-F085 by Onsemi is a N-CHANNEL Power FET with 250V DS Breakdown Voltage and 25.5A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.131 ohm On Resistance, and 417W Power Dissipation in a RECTANGULAR package.

Median Price

$1.738

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 19,780 parts In-Stock

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-

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19,780

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Rochester

USA . 5,600 parts In-Stock

1+ parts

-

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$1.520

1k+ parts

$1.260

10k+ parts

$1.120

5,600

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$1.520

$1.260

$1.120

DigiKey

USA . 5,600 parts In-Stock

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$1.900

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5,600

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$1.900

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Verical

USA . 5,600 parts In-Stock

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$1.575

10k+ parts

$1.400

5,600

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$1.575

$1.400

Mouser Electronics

USA . 590 parts In-Stock

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$1.910

10k+ parts

$1.730

590

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-

$1.910

$1.730

Distributors (In-Stock)

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Digiode

USA . 1,638 parts In-Stock

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$1.188

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1,638

$1.188

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Vyrian

USA . 2,329 parts In-Stock

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$1.250

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2,329

$1.250

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Flip Electronics

USA . 19,780 parts In-Stock

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19,780

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DigiKey Marketplace

USA . 19,780 parts In-Stock

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19,780

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Distributors (Availability)

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Corphita

USA . 1,598 parts In-Stock

1+ parts

$1.125

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1,598

$1.125

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Corohmni

South Africa . 178 parts In-Stock

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$1.250

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178

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Native Components

USA . 891 parts In-Stock

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$1.990

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891

$1.990

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Northwest PG Solutions

USA . 2,166 parts In-Stock

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$2.189

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$2.189

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Microchip USA

USA . 6,576 parts In-Stock

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$7.800

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$7.800

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

Latvia . 6,088 parts In-Stock

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SupplyDigital Components

Austria . 5,190 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Problanco Electronics

Mexico . 2,824 parts In-Stock

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Supply Digital

USA . 2,361 parts In-Stock

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2,361

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Kulean Microsystems

USA . 1,527 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 9 parts In-Stock

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Overview

Enhance your power switching applications with the FQB27N25TM-F085 by Onsemi. This high-quality N-channel power field effect transistor offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in semiconductor manufacturing. With a built-in diode and a maximum drain current of 25.5 A, this transistor is ideal for a wide range of switching applications. Trust in Onsemi to deliver the value, benefits, and advantages you need for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of electrons in the specified direction, enhancing the FET's performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and protects against reverse currents, making it a versatile and user-friendly option.

Transistor Application: SWITCHING

Optimized for switching applications, ensuring fast and efficient response times.

Surface Mount: YES

Enables easy integration onto the circuit board, saving space and facilitating automated assembly processes.

Minimum DS Breakdown Voltage: 250 V

Provides a high breakdown voltage, making the FET suitable for applications where voltage spikes may occur.

Maximum Drain Current (ID): 25.5 A

Capable of handling high current loads effectively, ensuring reliable operation under demanding conditions.

Maximum Power Dissipation (Abs): 417 W

Withstands high power dissipation levels, making it suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

Operates effectively at high temperatures, ensuring stability and reliability in various environments.

Maximum Drain-Source On Resistance: 0.131 ohm

Low on-resistance minimizes power losses and improves efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) FQB27N25TM-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

972 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

25.5 A

Maximum Drain Current (ID):

25.5 A

Maximum Drain-Source On Resistance:

.131 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB27N25TM-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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