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FQB22P10

Onsemi

FQB22P10 by Onsemi

FQB22P10 by Onsemi is a P-CHANNEL Power FET with 100V DS Breakdown Voltage, 88A IDM, and 0.125 ohm RDS(ON). Ideal for SWITCHING applications in ENHANCEMENT MODE operation. Features GULL WING terminals, METAL-OXIDE SEMICONDUCTOR tech, and operates up to 175 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,941 parts In-Stock

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Digiode

USA . 906 parts In-Stock

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Native Components

USA . 87 parts In-Stock

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$1.022

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Northwest PG Solutions

USA . 590 parts In-Stock

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$1.124

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Andel Nordic

Denmark . 111 parts In-Stock

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$3.033

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$2.912

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$2.912

A-Z Elektronik GmbH

Germany . 11,645 parts In-Stock

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SupplyDigital Components

Austria . 8,247 parts In-Stock

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Problanco Electronics

Mexico . 6,984 parts In-Stock

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Kulean Microsystems

USA . 5,236 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,263 parts In-Stock

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Corphita

USA . 2,513 parts In-Stock

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TANS Electronics

Latvia . 2,336 parts In-Stock

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UHIMA Technologies

Türkiye . 892 parts In-Stock

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Supply Digital

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Corohmni

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Perfect Parts

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Overview

Experience the superior quality and performance of the FQB22P10 Power Field Effect Transistor by Onsemi. With a reputation for excellence, Onsemi delivers reliable products that meet the highest industry standards. Ideal for switching applications, this P-CHANNEL transistor provides unparalleled efficiency and precision. Its built-in diode ensures seamless operation, while its compact design makes it perfect for space-constrained projects. Transform your electronic devices with the FQB22P10 and enjoy the benefits of enhanced functionality and durability. Choose Onsemi for cutting-edge technology and unmatched value in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for low on-state resistance and high speed, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this transistor convenient for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor is optimized for high-speed operation.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, making installation and assembly more efficient.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage ensures reliable performance and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape allows for a compact design, saving space in electronic devices.

Terminal Form: GULL WING

The gull wing terminals provide secure connections and ease of soldering during installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and low leakage current, improving efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 88 A

The high pulsed drain current rating enables the transistor to handle heavy loads and transient currents.

Avalanche Energy Rating (EAS): 710 mJ

The high avalanche energy rating indicates the transistor's ability to withstand voltage spikes and surges without damage.

No. of Terminals: 2

The simple two-terminal design simplifies circuit connections and reduces complexity in circuit layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, allowing for more compact and efficient designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in transistor operation.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures stability and reliability in various operating conditions.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, providing consistent performance and durability.

Maximum Drain Current (ID): 22 A

The high drain current rating allows the transistor to handle large currents with efficiency and reliability.

Maximum Drain-Source On Resistance: 0.125 ohm

The low on-resistance ensures minimal power loss and high efficiency during operation.

Terminal Position: SINGLE

Single terminal position simplifies circuit connections and layout, improving ease of use and installation.

Case Connection: DRAIN

The drain case connection offers a secure and reliable connection point for the transistor in circuit applications.

Technical Specifications

Power Field Effect Transistors (FET) FQB22P10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING, AVALANCHE RATED

Avalanche Energy Rating (EAS):

710 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB22P10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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