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FQB25N33TM-F085

Onsemi

FQB25N33TM-F085 by Onsemi

FQB25N33TM-F085 by Onsemi is a N-CHANNEL Power FET with 330V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a 100A Max Pulsed Drain Current and 370mJ Avalanche Energy Rating. The transistor operates in ENHANCEMENT MODE and has a max temperature of 150°C, making it suitable for various power management tasks.

Median Price

$1.640

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 50,400 parts In-Stock

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Rochester

USA . 8,000 parts In-Stock

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$1.640

1k+ parts

$1.470

10k+ parts

$1.380

8,000

-

$1.640

$1.470

$1.380

Distributors (In-Stock)

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Vyrian

USA . 1,789 parts In-Stock

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$1.510

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$1.510

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Digiode

USA . 2,143 parts In-Stock

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$1.729

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$1.729

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DF Sales Co.

USA . 5 parts In-Stock

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$2.100

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5

$2.100

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DF Sales Co.

USA . 5 parts In-Stock

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$2.100

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$2.100

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Flip Electronics

USA . 50,400 parts In-Stock

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50,400

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DigiKey Marketplace

USA . 50,400 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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Corohmni

South Africa . 397 parts In-Stock

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$1.510

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Corphita

USA . 2,473 parts In-Stock

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$1.638

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Microchip USA

USA . 452 parts In-Stock

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$11.375

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Continental Prestige Electronics

USA . 8,000 parts In-Stock

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Austria . 5,350 parts In-Stock

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Kulean Microsystems

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 3,741 parts In-Stock

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Kepictronics

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Native Components

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Problanco Electronics

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Northwest PG Solutions

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UHIMA Technologies

Türkiye . 2 parts In-Stock

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Overview

Discover the superior performance and reliability of the FQB25N33TM-F085 by Onsemi, a leading manufacturer in the industry. As a Power Field Effect Transistor, this product offers exceptional quality for various switching applications. With its N-CHANNEL configuration and built-in diode, it ensures efficient operation and enhanced functionality. Experience the benefits of its 330V minimum DS breakdown voltage and 100A maximum pulsed drain current, providing unmatched value and versatility to customers. Trust in Onsemi's expertise and innovation to elevate your electronic designs with the FQB25N33TM-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and faster switching speeds compared to P-channel FETs, making them more efficient for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the FET from reverse voltage spikes, improving its reliability and performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for efficient and reliable operation in power control circuits.

Maximum DS Breakdown Voltage: 330 V

With a high breakdown voltage, this FET can handle high voltage applications with ease, providing a robust solution for power switching.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer fast switching speeds and low on-state resistance, making them ideal for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FQB25N33TM-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

370 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

330 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB25N33TM-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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