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FGP3040G2-F085

Onsemi

FGP3040G2-F085 by Onsemi

Onsemi's FGP3040G2-F085 is an N-CHANNEL IGBT with 7000ns rise time, 15000ns fall time, and 150W power dissipation. Ideal for applications requiring a max collector-emitter voltage of 390V, such as power electronics and motor control systems.

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Native Components

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Northwest PG Solutions

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Modulus Dynamics

Lithuania . 300 parts In-Stock

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Microchip USA

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Overview

Unleash the power of innovation with the FGP3040G2-F085 by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are designed to exceed expectations. Whether you need reliable performance in industrial machinery or efficient power conversion in renewable energy systems, this N-CHANNEL IGBT offers unparalleled value and benefits. Say goodbye to downtime and hello to seamless operations with the FGP3040G2-F085 – the ultimate solution for your power needs.

Feature Benefit Bullets

Maximum Rise Time (tr): 7000 ns

With a fast rise time, this IGBT can quickly switch on and off, making it suitable for applications requiring precise control.

Maximum Fall Time (tf): 15000 ns

The relatively fast fall time ensures efficient switching and reduces switching losses in the circuit.

Maximum Power Dissipation (Abs): 150 W

This IGBT can handle high power dissipation levels, making it suitable for applications requiring high power output.

Maximum Operating Temperature: 175 °C

With a high operating temperature, this IGBT can withstand elevated temperatures without compromising its performance.

Maximum Collector-Emitter Voltage: 390 V

The high collector-emitter voltage rating allows this IGBT to be used in applications with high voltage requirements.

Maximum Gate-Emitter Voltage: 12 V

The gate-emitter voltage rating ensures proper gate control, leading to reliable performance in the circuit.

Maximum Collector Current (IC): 41 A

With a high collector current rating, this IGBT can handle large current flows, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 2.2 V

The gate-emitter threshold voltage indicates the minimum voltage required to turn on the IGBT, ensuring precise control over its operation.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and ensures reliable connections for the IGBT in the circuit.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGP3040G2-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

390 V

Maximum Fall Time (tf):

15000 ns

Maximum Gate-Emitter Threshold Voltage:

2.2 V

Maximum Gate-Emitter Voltage:

12 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

7000 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

FGP3040G2-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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