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FDS6875

Onsemi

FDS6875 by Onsemi

FDS6875 by Onsemi is a P-CHANNEL Power FET with 20V DS Breakdown Voltage and 6A Drain Current. Ideal for SWITCHING applications, it features a PLASTIC/EPOXY package, GULL WING terminals, and operates in ENHANCEMENT MODE. With a max power dissipation of 2W and peak reflow temp of 260°C, it's suitable for various electronic designs.

Median Price

$0.559

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 214 parts In-Stock

1+ parts

$0.506

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$0.501

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214

$0.506

$0.501

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Chip1Stop

Japan . 7,500 parts In-Stock

1+ parts

$0.550

100+ parts

$0.475

1k+ parts

$0.453

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$0.435

7,500

$0.550

$0.475

$0.453

$0.435

Element14

Singapore . 475 parts In-Stock

1+ parts

$0.590

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475

$0.590

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Rochester

USA . 47,874 parts In-Stock

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$0.700

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$0.690

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$0.670

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$0.700

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Verical

USA . 7,500 parts In-Stock

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$0.482

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$0.459

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$0.447

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$0.482

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$0.447

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Mouser Electronics

USA . 1,301 parts In-Stock

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$0.559

1,301

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Farnell

UK . 895 parts In-Stock

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$0.571

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$0.453

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$0.453

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Distributors (In-Stock)

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Digiode

USA . 2,317 parts In-Stock

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$0.390

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Nova Conductors

Japan . 200 parts In-Stock

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$0.669

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$0.669

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Component Electronics Inc.

Canada . 723 parts In-Stock

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$0.990

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$0.740

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$0.650

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723

$0.990

$0.740

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Bristol Electronics

USA . 482 parts In-Stock

1+ parts

$1.500

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$0.555

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$0.480

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482

$1.500

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$0.480

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Chip Stock

USA . 69,000 parts In-Stock

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Component Sense

UK . 15,567 parts In-Stock

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Cyclops Electronics Ltd

UK . 7,389 parts In-Stock

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Vyrian

USA . 7,354 parts In-Stock

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Flip Electronics

USA . 3,529 parts In-Stock

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Prism Electronics

USA . 2,821 parts In-Stock

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Legend Electronics Inc.

USA . 2,737 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,407 parts In-Stock

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Dan-Mar Components

USA . 2,407 parts In-Stock

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R&J Components

USA . 1,317 parts In-Stock

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Electronic Expediters

USA . 1,161 parts In-Stock

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EMSNET

USA . 69 parts In-Stock

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Diverse Electronics

Canada . 10 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Decca Corp

Germany . 7,159 parts In-Stock

1+ parts

$0.361

100+ parts

$0.354

1k+ parts

$0.350

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7,159

$0.361

$0.354

$0.350

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Semicontronic

India . 7,306 parts In-Stock

1+ parts

$0.366

100+ parts

$0.357

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$0.355

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7,306

$0.366

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$0.355

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Corphita

USA . 1,471 parts In-Stock

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$0.370

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Ampacity Inc.

Singapore . 7,315 parts In-Stock

1+ parts

$0.399

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Corohmni

South Africa . 437 parts In-Stock

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$0.406

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437

$0.406

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Aztec Data Supply Inc.

USA . 3,926 parts In-Stock

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$0.649

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3,926

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Argo Parts USA

USA . 2,335 parts In-Stock

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$0.669

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$0.648

2,335

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$0.648

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$1.608

100+ parts

$1.527

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$1.527

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$1.608

$1.527

$1.527

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Perfect Parts

USA . 74,784 parts In-Stock

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Assy Fe

Spain . 14,411 parts In-Stock

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Microchip USA

USA . 9,649 parts In-Stock

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Kulean Microsystems

USA . 8,011 parts In-Stock

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Problanco Electronics

Mexico . 7,245 parts In-Stock

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TANS Electronics

Latvia . 4,166 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Continental Prestige Electronics

USA . 3,795 parts In-Stock

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$0.629

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SupplyDigital Components

Austria . 3,469 parts In-Stock

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Supply Digital

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Kepictronics

USA . 2,500 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Eastek

USA . 2,500 parts In-Stock

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Computer Components Inc. - USA

USA . 2,500 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.655

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$0.635

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$0.622

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$0.635

$0.622

Authorized Procurement Solutions

USA . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 365 parts In-Stock

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Overview

Discover the power of the FDS6875 by Onsemi, a high-quality P-Channel Power Field Effect Transistor with built-in diode. Designed for switching applications, this versatile component offers a maximum drain current of 6A and a low on-resistance of 0.03 ohm. With a small outline package style and surface mount option, the FDS6875 is perfect for a wide range of electronic devices, ensuring efficient performance and reliability. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the value and benefits of the FDS6875.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

Suitable for applications where a negative voltage is required, offering versatility in circuit design.

Minimum DS Breakdown Voltage: 20 V

Can handle higher voltages, making it ideal for applications where voltage spikes may occur.

Maximum Power Dissipation (Abs): 2 W

Capable of dissipating heat efficiently, preventing overheating and ensuring stable operation.

Maximum Drain-Source On Resistance: 0.03 ohm

Low on-resistance ensures minimal power loss and high efficiency in switching applications.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, suitable for various industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FDS6875 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS6875 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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