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FDS6690AS

Onsemi

FDS6690AS by Onsemi

FDS6690AS by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 10A, 0.012 ohm On Resistance, and 2.5W Power Dissipation in a SMALL OUTLINE package. Operating b/w -55 to 150 °C, it offers fast switching times of 40ns turn on and 43ns turn off for efficient performance.

Median Price

$0.444

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 60 parts In-Stock

1+ parts

$0.435

100+ parts

$0.400

1k+ parts

$0.375

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60

$0.435

$0.400

$0.375

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Rochester

USA . 101,356 parts In-Stock

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$0.452

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$0.376

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$0.335

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$0.452

$0.376

$0.335

Verical

USA . 59,264 parts In-Stock

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$0.469

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$0.418

59,264

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$0.469

$0.418

DigiKey

USA . 2,269 parts In-Stock

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$0.250

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$0.250

Flip Electronics (Authorized)

USA . 2,269 parts In-Stock

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2,269

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Digiode

USA . 845 parts In-Stock

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$0.370

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845

$0.370

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Nova Conductors

Japan . 50 parts In-Stock

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$0.375

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$0.375

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$0.770

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$0.580

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$0.500

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5

$0.770

$0.580

$0.500

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Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

$0.938

100+ parts

$0.347

1k+ parts

$0.244

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2,500

$0.938

$0.347

$0.244

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Ozdisan Elektronik

Türkiye . 5,224 parts In-Stock

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$20.163

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Vyrian

USA . 26,174 parts In-Stock

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Chip Stock

USA . 23,309 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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Odi Ramu Company

Canada . 2,500 parts In-Stock

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Dan-Mar Components

USA . 2,500 parts In-Stock

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Flip Electronics

USA . 2,269 parts In-Stock

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2,269

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Atlantic Semiconductor

USA . 2,100 parts In-Stock

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Classic Components Corporation

USA . 891 parts In-Stock

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891

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Lakeland Logistics Inc

USA . 430 parts In-Stock

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430

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Inventory MP

USA . 112 parts In-Stock

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112

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NexGen Digital

USA . 23 parts In-Stock

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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Prism Electronics

USA . 7 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 40,580 parts In-Stock

1+ parts

$0.331

100+ parts

$0.323

1k+ parts

$0.321

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40,580

$0.331

$0.323

$0.321

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Ampacity Inc.

Singapore . 26,346 parts In-Stock

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$0.331

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26,346

$0.331

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Continental Prestige Electronics

USA . 6,848 parts In-Stock

1+ parts

$0.347

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$0.340

6,848

$0.347

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$0.340

Argo Parts USA

USA . 3,687 parts In-Stock

1+ parts

$0.347

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$0.336

3,687

$0.347

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$0.336

Corphita

USA . 2,074 parts In-Stock

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$0.350

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2,074

$0.350

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Corohmni

South Africa . 430 parts In-Stock

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$0.367

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430

$0.367

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Netroflash

USA . 500 parts In-Stock

1+ parts

$0.375

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$0.356

10k+ parts

$0.348

500

$0.375

-

$0.356

$0.348

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$0.435

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$0.400

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$0.375

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60

$0.435

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$0.375

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Aztec Data Supply Inc.

USA . 635 parts In-Stock

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$1.387

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635

$1.387

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Perfect Parts

USA . 59,708 parts In-Stock

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59,708

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Robosynatics

Brazil . 14,421 parts In-Stock

1+ parts

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$0.902

1k+ parts

$0.883

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$0.883

14,421

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$0.902

$0.883

$0.883

Lucentia Tech

USA . 14,421 parts In-Stock

1+ parts

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$0.902

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$0.883

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$0.883

14,421

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$0.902

$0.883

$0.883

Authorized Procurement Solutions

USA . 5,835 parts In-Stock

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5,835

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GreenTree Electronics

Israel . 5,396 parts In-Stock

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Kulean Microsystems

USA . 3,729 parts In-Stock

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Problanco Electronics

Mexico . 3,618 parts In-Stock

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TANS Electronics

Latvia . 3,319 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,509 parts In-Stock

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iodParts Technologies Inc.

India . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 2,427 parts In-Stock

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Assy Fe

Spain . 2,345 parts In-Stock

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Supply Digital

USA . 2,293 parts In-Stock

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UHIMA Technologies

Türkiye . 908 parts In-Stock

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Kepictronics

USA . 525 parts In-Stock

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525

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Speed Components Ltd (Excess)

Israel . 500 parts In-Stock

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500

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Computer Components Inc. - USA

USA . 186 parts In-Stock

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ChipstoGo Electronic ltd

UK . 50 parts In-Stock

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50

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Overview

Discover the power of innovation with the FDS6690AS by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for switching applications. With a maximum drain current of 10A and a low on-resistance of 0.012 ohm, this N-channel transistor offers unparalleled performance and efficiency. Its small outline package and built-in diode make it a versatile choice for a wide range of projects. Trust Onsemi to provide reliable solutions that exceed expectations. Elevate your designs with the FDS6690AS and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency compared to P-channel transistors, making this product a good choice for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient operation and protection against reverse voltage, making this transistor ideal for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures fast and reliable performance in various electronic circuits.

Surface Mount: YES

The surface mount configuration allows for easy installation on circuit boards, saving time and space in electronic designs.

Minimum DS Breakdown Voltage: 30V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages, making it suitable for a wide range of power applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides stability and ease of mounting in electronic circuits.

Terminal Form: GULL WING

The gull-wing terminal form allows for efficient soldering and strong mechanical connections, ensuring reliability in operation.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation ensures fast switching speeds and low power consumption, making this transistor ideal for energy-efficient applications.

Maximum Pulsed Drain Current (IDM): 50A

With a maximum pulsed drain current of 50A, this transistor can handle high peak currents, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 10A

The maximum drain current rating of 10A allows for high current flow, making this transistor a reliable choice for various circuit applications.

No. of Terminals: 8

With 8 terminals, this transistor provides flexibility and versatility in circuit connections, allowing for a wide range of electronic designs.

Maximum Power Dissipation (Abs): 2.5W

The maximum power dissipation of 2.5W ensures efficient heat dissipation, making this transistor suitable for high-power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on circuit boards, making this transistor ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers high performance and reliability, making this transistor a dependable choice for various applications.

Maximum Operating Temperature: 150°C

With a maximum operating temperature of 150°C, this transistor can withstand high temperatures, ensuring stability in various environmental conditions.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties, ensuring reliable performance and longevity in electronic circuits.

Maximum Turn On Time (ton): 40ns

The fast turn-on time of 40ns ensures quick response in switching applications, making this transistor suitable for high-speed circuit designs.

Minimum Operating Temperature: -55°C

The minimum operating temperature of -55°C allows this transistor to function reliably in cold environments, making it suitable for a wide range of applications.

Maximum Turn Off Time (toff): 43ns

The fast turn-off time of 43ns ensures efficient switching performance, making this transistor ideal for high-frequency applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections in electronic circuits.

Maximum Drain Current (ID): 10A

With a maximum drain current of 10A, this transistor can handle high current loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.012ohm

The low drain-source on resistance of 0.012ohm ensures minimal power loss and high efficiency in circuit designs.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit connections, allowing for versatile electronic designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this transistor can withstand high temperatures during soldering, ensuring reliability in assembly processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures effective soldering and strong connections, making this transistor suitable for high-temperature assembly processes.

Maximum Feedback Capacitance (Crss): 100pF

The maximum feedback capacitance of 100pF ensures stable performance in RF and high-frequency applications, making this transistor a reliable choice for such circuits.

Technical Specifications

Power Field Effect Transistors (FET) FDS6690AS attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

100 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

43 ns

Maximum Turn On Time (ton):

40 ns

Trade Compliance

FDS6690AS Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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