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FDS6910

Onsemi

FDS6910 by Onsemi

FDS6910 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 2 ELEMENTS WITH BUILT-IN DIODE in a PLASTIC/EPOXY package, it offers 20A Max Pulsed Drain Current and 0.013 ohm Max Drain-Source Resistance. Suitable for ENHANCEMENT MODE operation at temperatures ranging from -55 to 150 °C.

Median Price

$0.742

Lifecycle Status

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17

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1k+

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Rochester

USA . 1,600 parts In-Stock

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$0.659

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$0.547

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$0.488

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$0.659

$0.547

$0.488

Verical

USA . 1,000 parts In-Stock

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$0.824

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Digiode

USA . 719 parts In-Stock

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$0.514

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Nova Conductors

Japan . 700 parts In-Stock

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$3.850

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Chip Stock

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Vyrian

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MRC Electronics

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Lantek

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Prism Electronics

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NPI Materials, Inc.

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J2 Sourcing AB

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NexGen Digital

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Technoshack Inc.

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Semicontronic

India . 12,502 parts In-Stock

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$0.460

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$0.448

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$0.446

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$0.460

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Corphita

USA . 1,586 parts In-Stock

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$0.487

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Corohmni

South Africa . 492 parts In-Stock

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$0.541

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Ampacity Inc.

Singapore . 15,346 parts In-Stock

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$1.000

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Continental Prestige Electronics

USA . 692 parts In-Stock

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$1.018

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Argo Parts USA

USA . 438 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,826 parts In-Stock

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Microchip USA

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Andel Nordic

Denmark . 565 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

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Kulean Microsystems

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Advanced Electronics

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UHIMA Technologies

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Problanco Electronics

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Overview

Elevate your power management with the FDS6910 by Onsemi, a top-tier manufacturer known for quality and innovation. This N-channel Power FET offers seamless switching capabilities in a compact package, making it ideal for a variety of applications. With a maximum drain current of 7.5 A and a low on-resistance of 0.013 ohm, this transistor ensures optimal performance and efficiency. Say goodbye to overheating and hello to reliability with the FDS6910 - your solution for superior power control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient control of power flow.

Surface Mount: YES

Suitable for automated assembly processes and compact designs, perfect for modern electronics manufacturing.

Maximum Drain-Source On Resistance: 0.013 ohm

Low on-resistance minimizes power loss and improves efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDS6910 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

7.5 A

Maximum Drain Current (ID):

7.5 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

100 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

56 ns

Maximum Turn On Time (ton):

28 ns

Trade Compliance

FDS6910 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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