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FDMS86550

Onsemi

FDMS86550 by Onsemi

FDMS86550 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 320A and EAS of 937mJ, suitable for high-power operations. With 0.00165 ohm RDS(on), it ensures efficient performance in ENHANCEMENT MODE at up to 150°C operating temperature.

Median Price

$5.631

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,424 parts In-Stock

1+ parts

$7.400

100+ parts

$3.784

1k+ parts

-

10k+ parts

$3.092

4,424

$7.400

$3.784

-

$3.092

Mouser Electronics

USA . 3,541 parts In-Stock

1+ parts

$7.400

100+ parts

$3.790

1k+ parts

$3.680

10k+ parts

$3.580

3,541

$7.400

$3.790

$3.680

$3.580

Avnet

USA . 30,000 parts In-Stock

1+ parts

-

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30,000

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Flip Electronics (Authorized)

USA . 10,618 parts In-Stock

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10,618

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Rochester

USA . 2,330 parts In-Stock

1+ parts

-

100+ parts

$3.090

1k+ parts

$2.760

10k+ parts

$2.600

2,330

-

$3.090

$2.760

$2.600

Verical

USA . 2,330 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.450

10k+ parts

$3.250

2,330

-

$3.862

$3.450

$3.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,457 parts In-Stock

1+ parts

$3.268

100+ parts

-

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1,457

$3.268

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.810

100+ parts

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300

$3.810

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Bristol Electronics

USA . 442,001 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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442,001

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Flip Electronics

USA . 10,178 parts In-Stock

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10,178

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Vyrian

USA . 7,060 parts In-Stock

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7,060

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NAC Semi

USA . 6,000 parts In-Stock

1+ parts

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$14.140

6,000

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$14.140

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

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$9.916

3,000

-

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$9.916

NexGen Digital

USA . 15 parts In-Stock

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15

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,555 parts In-Stock

1+ parts

$0.410

100+ parts

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2,555

$0.410

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Ampacity Inc.

Singapore . 7,156 parts In-Stock

1+ parts

$2.920

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7,156

$2.920

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Corphita

USA . 2,258 parts In-Stock

1+ parts

$3.096

100+ parts

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2,258

$3.096

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Corohmni

South Africa . 212 parts In-Stock

1+ parts

$3.440

100+ parts

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212

$3.440

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$3.734

100+ parts

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1k+ parts

$3.584

10k+ parts

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50

$3.734

-

$3.584

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Continental Prestige Electronics

USA . 5,469 parts In-Stock

1+ parts

$3.810

100+ parts

-

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$3.734

5,469

$3.810

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$3.734

Argo Parts USA

USA . 3,004 parts In-Stock

1+ parts

$3.810

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3,004

$3.810

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Semicontronic

India . 6,927 parts In-Stock

1+ parts

$6.360

100+ parts

$6.201

1k+ parts

$6.169

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6,927

$6.360

$6.201

$6.169

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Microchip USA

USA . 5,044 parts In-Stock

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$22.666

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5,044

$22.666

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BidChips

USA . 442,001 parts In-Stock

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iBuyXS LLC

. 442,001 parts In-Stock

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442,001

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GreenTree Electronics

Israel . 24,000 parts In-Stock

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Eastek

USA . 21,000 parts In-Stock

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Perfect Parts

USA . 13,808 parts In-Stock

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Lixinc

USA . 11,325 parts In-Stock

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Problanco Electronics

Mexico . 6,282 parts In-Stock

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Kulean Microsystems

USA . 5,498 parts In-Stock

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SupplyDigital Components

Austria . 4,372 parts In-Stock

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4,372

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Supply Digital

USA . 2,681 parts In-Stock

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2,681

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Infinite Electronics LLP (Excess)

. 1,396 parts In-Stock

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1,396

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TANS Electronics

Latvia . 1,361 parts In-Stock

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1,361

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UHIMA Technologies

Türkiye . 862 parts In-Stock

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862

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Kepictronics

USA . 600 parts In-Stock

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600

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Overview

Unlock the power of efficient switching with the FDMS86550 by Onsemi. Crafted with precision and quality by a trusted manufacturer, this N-CHANNEL Power FET offers unrivaled performance for various applications. Experience seamless operation and enhanced energy efficiency with its built-in diode configuration. With a maximum drain current of 32A and a minimum DS breakdown voltage of 60V, this transistor is a game-changer in the field. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the FET, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making this product a reliable choice.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and helps prevent backflow of current, making this FET suitable for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this FET is optimized for fast response and minimal power loss during on/off transitions.

Surface Mount: YES

Easy to install and saves space on the PCB, making this FET ideal for compact designs and mass production.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle high voltages safely, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and align the FET on the PCB, ensuring proper connection and performance.

Terminal Form: NO LEAD

Lead-free terminals are environmentally friendly and comply with regulations, making this FET a sustainable option.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and have lower on-state resistance, improving overall efficiency and performance.

Maximum Pulsed Drain Current (IDM): 320 A

With a high pulsed drain current rating, this FET can handle peak loads effectively, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 937 mJ

High avalanche energy rating ensures the FET can withstand short circuits and other transient events without damage, increasing reliability.

Maximum Drain Current (Abs) (ID): 100 A

High drain current rating allows the FET to handle large currents without overheating, making it reliable for demanding applications.

No. of Terminals: 5

Sufficient terminals for proper connection and control, ensuring reliable performance in a circuit.

Maximum Power Dissipation (Abs): 156 W

With high power dissipation capability, this FET can handle high power levels without overheating, ensuring stable operation.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space on the PCB and allows for dense integration, making it suitable for small electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and low gate capacitance, improving switching speed and overall performance.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can operate effectively in harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon-based elements offer high reliability and consistency in performance, making this FET a dependable choice for various applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides excellent solderability and resistance to corrosion, ensuring long-term reliability in a circuit.

Maximum Drain Current (ID): 32 A

High drain current rating allows the FET to handle large currents without overheating, making it reliable for demanding applications.

Maximum Drain-Source On Resistance: 0.00165 ohm

Low on-resistance minimizes power losses and improves efficiency, making this FET ideal for high-power applications.

Terminal Position: DUAL

Dual terminal position allows for easy installation and connection in a circuit, ensuring proper functionality.

Case Connection: DRAIN

Drain connection design simplifies circuit layout and ensures efficient current flow, improving overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on the FET during assembly, ensuring reliability and longevity.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component integrity during assembly, enhancing reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDMS86550 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

937 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

32 A

Maximum Drain-Source On Resistance:

.00165 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240AA

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMS86550 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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