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FDD6670A

Onsemi

FDD6670A by Onsemi

FDD6670A by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 0.008 ohm Max RDS(on). Ideal for SWITCHING applications, it features 100A IDM, 67mJ EAS, and 70W Max Power Dissipation. With ENHANCEMENT MODE operation and SILICON transistor element material, it offers reliable performance in various electronic systems.

Median Price

$0.710

Lifecycle Status

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29

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1k+

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Chip1Stop

Japan . 1,553 parts In-Stock

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DigiKey

USA . 2,042 parts In-Stock

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Arrow

USA . 7,500 parts In-Stock

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Rochester

USA . 129,402 parts In-Stock

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Verical

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Mouser Electronics

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Vyrian

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Freelance Electronics

USA . 450 parts In-Stock

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Digiode

USA . 893 parts In-Stock

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Cyclops Electronics Ltd

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Bristol Electronics

USA . 5,124 parts In-Stock

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Atlantic Semiconductor

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Prism Electronics

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Electronic Expediters

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R&J Components

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ComSIT Distribution GmbH

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Dan-Mar Components

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Nova Conductors

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Lighthouse Electronics, Inc.

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Semtec, LLC

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Sea View Technologies

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Electronics Depot

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Corohmni

South Africa . 361 parts In-Stock

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Ampacity Inc.

Singapore . 16,918 parts In-Stock

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Corphita

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Component Stockers USA

USA . 190,558 parts In-Stock

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Continental Prestige Electronics

USA . 1,751 parts In-Stock

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$0.663

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Microchip USA

USA . 3,553 parts In-Stock

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Perfect Parts

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Lixinc

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SupplyDigital Components

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ChipTracer

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GreenTree Electronics

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Supply Digital

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Kulean Microsystems

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Glotronic Ltd.

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UHIMA Technologies

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Kepictronics

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Overview

Looking for a reliable power field-effect transistor for your switching applications? Look no further than the Onsemi FDD6670A. Manufactured by Onsemi, known for their high-quality components, this N-channel transistor offers a single configuration with a built-in diode, making it perfect for enhancing your circuit designs. With a maximum pulsed drain current of 100A and a minimum DS breakdown voltage of 30V, this transistor provides outstanding performance and reliability. Whether you're working on industrial or automotive projects, the FDD6670A offers the value and benefits you need to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection and durability for the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and faster switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better protection against reverse currents, enhancing the overall reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers efficient and reliable performance in controlling electrical signals.

Maximum Power Dissipation (Abs): 70 W

With a high power dissipation rating, this FET can handle a significant amount of heat without compromising its performance, ensuring stable operation.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows for reliable operation in potentially hot environments, making this FET suitable for a variety of applications.

Maximum Drain Current (ID): 15 A

Capable of handling up to 15 A of drain current, this FET is suitable for medium to high-power applications where a robust current-handling capacity is required.

Maximum Drain-Source On Resistance: 0.008 ohm

With a low on-resistance, this FET minimizes power loss and heat generation during operation, leading to improved efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) FDD6670A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

67 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

66 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD6670A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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