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FDD6690A

Onsemi

FDD6690A by Onsemi

FDD6690A by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 100A IDM, and 0.0125 ohm RDS. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE at up to 175°C, making it suitable for high-power tasks.

Median Price

$0.634

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 54,019 parts In-Stock

1+ parts

$0.700

100+ parts

$0.690

1k+ parts

$0.670

10k+ parts

-

54,019

$0.700

$0.690

$0.670

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DigiKey

USA . 1,166 parts In-Stock

1+ parts

$1.390

100+ parts

$0.974

1k+ parts

$0.596

10k+ parts

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1,166

$1.390

$0.974

$0.596

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Arrow

USA . 10,000 parts In-Stock

1+ parts

-

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$0.420

10,000

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$0.420

Verical

USA . 10,000 parts In-Stock

1+ parts

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$0.420

10,000

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$0.420

RS (Exports)

UK . 6,710 parts In-Stock

1+ parts

-

100+ parts

$0.634

1k+ parts

$0.384

10k+ parts

$0.345

6,710

-

$0.634

$0.384

$0.345

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,896 parts In-Stock

1+ parts

$0.420

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-

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2,896

$0.420

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Flip Electronics

USA . 1,076 parts In-Stock

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$0.470

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-

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1,076

$0.470

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TME

Poland . 1,550 parts In-Stock

1+ parts

$0.870

100+ parts

$0.550

1k+ parts

$0.510

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1,550

$0.870

$0.550

$0.510

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Sensible Micro Corp

USA . 29,339 parts In-Stock

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29,339

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Chip Stock

USA . 8,670 parts In-Stock

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8,670

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Ashlea Components Ltd

UK . 4,306 parts In-Stock

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4,306

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Semi Source

USA . 2,248 parts In-Stock

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Digiode

USA . 2,037 parts In-Stock

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2,037

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R&J Components

USA . 1,898 parts In-Stock

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1,898

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ACDS - Activité Composants Distribution Service

France . 1,429 parts In-Stock

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1,429

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Bristol Electronics

USA . 578 parts In-Stock

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578

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MRC Electronics

USA . 448 parts In-Stock

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448

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LIBRA Elektronik GmbH

Germany . 317 parts In-Stock

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317

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ComSIT Distribution GmbH

Germany . 300 parts In-Stock

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300

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Cyclops Electronics Ltd

UK . 175 parts In-Stock

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175

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Mil-Aero Solutions, Inc.

USA . 150 parts In-Stock

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150

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,644 parts In-Stock

1+ parts

$0.357

100+ parts

-

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9,644

$0.357

-

-

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Corohmni

South Africa . 195 parts In-Stock

1+ parts

$0.420

100+ parts

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195

$0.420

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Component Stockers USA

USA . 36,605 parts In-Stock

1+ parts

$0.940

100+ parts

$0.660

1k+ parts

$0.450

10k+ parts

$0.390

36,605

$0.940

$0.660

$0.450

$0.390

Microchip USA

USA . 224 parts In-Stock

1+ parts

$2.990

100+ parts

$2.980

1k+ parts

$2.980

10k+ parts

$2.970

224

$2.990

$2.980

$2.980

$2.970

Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

USA . 23,401 parts In-Stock

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Lixinc

USA . 18,842 parts In-Stock

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SupplyDigital Components

Austria . 8,075 parts In-Stock

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Kulean Microsystems

USA . 5,125 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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QUARKTWIN TECHNOLOGY LTD

USA . 3,535 parts In-Stock

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3,535

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Cyclops Electronics Ltd (Excess)

UK . 3,365 parts In-Stock

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Corphita

USA . 3,104 parts In-Stock

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Assy Fe

Spain . 3,000 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Problanco Electronics

Mexico . 2,340 parts In-Stock

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2,340

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iodParts Technologies Inc.

India . 2,067 parts In-Stock

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2,067

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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1,500

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Supply Digital

USA . 1,255 parts In-Stock

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1,255

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UHIMA Technologies

Türkiye . 892 parts In-Stock

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892

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TANS Electronics

Latvia . 98 parts In-Stock

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98

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Overview

Discover the ultimate power of the FDD6690A by Onsemi, a top-of-the-line Power Field Effect Transistor designed to enhance your switching applications. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge technology in every product they create. The FDD6690A offers unmatched performance with its N-CHANNEL configuration and built-in diode, ensuring seamless operation. Whether you're looking to optimize efficiency or boost productivity, this transistor is the solution you've been searching for. Upgrade to the FDD6690A today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are commonly used in switching applications due to their fast switching speeds and high efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages without experiencing failure.

Maximum Pulsed Drain Current (IDM): 100 A

High pulsed drain current rating allows the transistor to handle peak current loads effectively.

Maximum Power Dissipation (Abs): 50 W

The high power dissipation capability ensures the transistor can operate under heavy load conditions without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds, making it a reliable choice for various applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this transistor can withstand high temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) FDD6690A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

46 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.0125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD6690A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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