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FDD6688

Onsemi

FDD6688 by Onsemi

FDD6688 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 100A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.005 ohm RDS(on), and 83W Pdiss. Suitable for surface mount with GULL WING terminals, this MOSFET operates in ENHANCEMENT MODE up to 175°C.

Median Price

$1.462

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 149,182 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.170

10k+ parts

$1.040

149,182

-

$1.410

$1.170

$1.040

DigiKey

USA . 146,976 parts In-Stock

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$1.760

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146,976

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$1.760

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Verical

USA . 47,027 parts In-Stock

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$1.462

10k+ parts

$1.300

47,027

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$1.462

$1.300

Flip Electronics (Authorized)

USA . 22,330 parts In-Stock

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22,330

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Digiode

USA . 1,132 parts In-Stock

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$1.102

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1,132

$1.102

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Vyrian

USA . 933 parts In-Stock

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$1.160

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933

$1.160

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DigiKey Marketplace

USA . 147,196 parts In-Stock

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Flip Electronics

USA . 22,330 parts In-Stock

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22,330

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A2Z Electronics, Inc.

USA . 2,500 parts In-Stock

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2,500

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Bristol Electronics

USA . 591 parts In-Stock

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591

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Prism Electronics

USA . 93 parts In-Stock

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Electronic Expediters

USA . 41 parts In-Stock

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Native Components

USA . 518 parts In-Stock

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$0.261

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$0.251

518

$0.261

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$0.251

Northwest PG Solutions

USA . 1,207 parts In-Stock

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$0.288

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$0.254

1,207

$0.288

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$0.254

Corphita

USA . 578 parts In-Stock

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$1.044

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578

$1.044

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Corohmni

South Africa . 316 parts In-Stock

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$1.160

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316

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Microchip USA

USA . 6,805 parts In-Stock

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$7.215

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$7.215

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Metaverse IC Inc.

Canada . 116,063 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,671 parts In-Stock

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SupplyDigital Components

Austria . 8,039 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 7,120 parts In-Stock

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Kepictronics

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Perfect Parts

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Problanco Electronics

Mexico . 4,564 parts In-Stock

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GreenTree Electronics

Israel . 2,203 parts In-Stock

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Kulean Microsystems

USA . 1,832 parts In-Stock

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Supply Digital

USA . 1,072 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 667 parts In-Stock

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iodParts Technologies Inc.

India . 93 parts In-Stock

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Overview

Experience the power of innovation with the FDD6688 by Onsemi, a top-quality Power Field Effect Transistor (FET) that sets the standard for performance and reliability. With its N-CHANNEL design, SINGLE configuration, and built-in diode, this transistor is perfect for a wide range of SWITCHING applications. Its high power dissipation, maximum drain current of 84A, and low drain-source on resistance of 0.005 ohm ensure optimum efficiency and durability. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Elevate your projects with the FDD6688 and unleash unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal properties and insulation, making the transistor durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better efficiency and lower ON-resistance compared to P-Channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for efficient switching and protection against reverse currents, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in various electronic circuits.

Maximum Power Dissipation (Abs): 83 W

High power dissipation rating allows for handling high current loads without overheating, making it suitable for demanding applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can perform reliably in harsh environments without experiencing thermal breakdown.

Technical Specifications

Power Field Effect Transistors (FET) FDD6688 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

370 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

84 A

Maximum Drain Current (ID):

84 A

Maximum Drain-Source On Resistance:

.005 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDD6688 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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