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FDB024N08BL7

Onsemi

FDB024N08BL7 by Onsemi

FDB024N08BL7 by Onsemi is a power field effect transistor (FET) with a min DS breakdown voltage of 80V. It is an N-channel transistor used for switching applications, offering a max pulsed drain current of 916A and a max power dissipation of 246W.

Median Price

$3.934

Lifecycle Status

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11

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1k+

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Mouser Electronics

USA . 3,568 parts In-Stock

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$5.480

100+ parts

$2.460

1k+ parts

$2.450

10k+ parts

-

3,568

$5.480

$2.460

$2.450

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DigiKey

USA . 5,511 parts In-Stock

1+ parts

$5.610

100+ parts

$2.689

1k+ parts

$2.138

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5,511

$5.610

$2.689

$2.138

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Rochester

USA . 4,159 parts In-Stock

1+ parts

-

100+ parts

$2.140

1k+ parts

$1.910

10k+ parts

$1.800

4,159

-

$2.140

$1.910

$1.800

Verical

USA . 3,144 parts In-Stock

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$2.388

10k+ parts

$2.250

3,144

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$2.388

$2.250

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Digiode

USA . 2,150 parts In-Stock

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$2.261

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2,150

$2.261

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Nova Conductors

Japan . 900 parts In-Stock

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$3.090

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900

$3.090

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Flip Electronics

USA . 88,000 parts In-Stock

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88,000

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Vyrian

USA . 4,824 parts In-Stock

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4,824

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NAC Semi

USA . 3,200 parts In-Stock

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$3.240

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$3.030

3,200

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$3.240

$3.030

NexGen Digital

USA . 1,600 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 841 parts In-Stock

1+ parts

$0.870

100+ parts

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841

$0.870

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Ampacity Inc.

Singapore . 4,592 parts In-Stock

1+ parts

$2.020

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4,592

$2.020

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Corphita

USA . 2,160 parts In-Stock

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$2.142

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2,160

$2.142

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Corohmni

South Africa . 60 parts In-Stock

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$2.150

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60

$2.150

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Continental Prestige Electronics

USA . 5,994 parts In-Stock

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$3.090

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$3.028

5,994

$3.090

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$3.028

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.090

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$3.028

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1,000

$3.090

$3.028

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Argo Parts USA

USA . 821 parts In-Stock

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$3.090

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821

$3.090

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Microchip USA

USA . 2,030 parts In-Stock

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$19.563

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2,030

$19.563

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Perfect Parts

USA . 24,192 parts In-Stock

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Lixinc

USA . 7,996 parts In-Stock

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Problanco Electronics

Mexico . 5,925 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,645 parts In-Stock

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TANS Electronics

Latvia . 4,374 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,763 parts In-Stock

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SupplyDigital Components

Austria . 3,424 parts In-Stock

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Kulean Microsystems

USA . 3,384 parts In-Stock

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Kepictronics

USA . 3,036 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

USA . 795 parts In-Stock

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795

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UHIMA Technologies

Türkiye . 257 parts In-Stock

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257

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Overview

Experience the power of the FDB024N08BL7 by Onsemi, a top-of-the-line Power Field Effect Transistor (FET) that is set to revolutionize your switching applications. With its N-channel configuration and built-in diode, this enhancement mode transistor offers unrivaled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, you can be confident in the quality and precision of this product. Its small outline package shape and gull wing terminal form make it easy to integrate into any design. Boasting a maximum drain current of 120A and a minimum DS breakdown voltage of 80V, this FET delivers exceptional power and efficiency. Don't settle for anything less than the best - choose the FDB024N08BL7 by Onsemi for all your switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have lower ON-resistance and higher efficiency compared to P-CHANNEL transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

The transistor is specifically designed for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Surface mount technology allows for easy and automated assembly, saving time and costs in production.

Minimum DS Breakdown Voltage: 80 V

The high breakdown voltage allows for reliable operation in high voltage applications.

Package Shape: RECTANGULAR

Rectangular packages provide a good balance between space-saving design and ease of handling.

Terminal Form: GULL WING

Gull wing terminals are ideal for surface mount applications, providing strong mechanical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the switching operation, resulting in improved efficiency.

Maximum Pulsed Drain Current (IDM): 916 A

The high pulsed drain current rating allows the transistor to handle large current surges effectively.

Avalanche Energy Rating (EAS): 917 mJ

The high avalanche energy rating indicates the transistor's ability to withstand voltage spikes and transient events.

Maximum Drain Current (Abs) (ID): 120 A

The high drain current rating ensures the transistor can handle high current loads without overheating.

No. of Terminals: 6

The 6 terminals provide multiple connection points for easy integration into various circuit designs.

Maximum Power Dissipation (Abs): 246 W

The high power dissipation rating allows the transistor to handle high power applications without failure.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space on the PCB, making them ideal for compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability in transistor performance.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures the transistor can operate in harsh environmental conditions.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability in electronic applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides good solderability and ensures stable electrical connections.

Maximum Drain-Source On Resistance: 0.0024 ohm

The low ON resistance minimizes power loss and improves the efficiency of the transistor.

Terminal Position: SINGLE

Single terminal position simplifies the connection and ensures proper alignment on the PCB.

Case Connection: DRAIN

Drain connection simplifies the circuit design and ensures proper current flow through the transistor.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures the transistor can withstand the thermal stress during assembly processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures proper soldering and reliability in manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) FDB024N08BL7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

917 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0024 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

916 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB024N08BL7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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