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FDB075N15A-F085

Onsemi

FDB075N15A-F085 by Onsemi

Onsemi's FDB075N15A-F085 is a N-CHANNEL Power FET with 150V DS Breakdown Voltage and 110A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0075 ohm On Resistance, and operates in ENHANCEMENT MODE. Suitable for high-power circuits requiring efficient switching capabilities.

Median Price

$2.380

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,120 parts In-Stock

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$2.380

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Flip Electronics (Authorized)

USA . 858 parts In-Stock

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Nova Conductors

Japan . 189 parts In-Stock

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$2.759

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Chip Stock

USA . 46,200 parts In-Stock

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Digiode

USA . 2,474 parts In-Stock

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Flip Electronics

USA . 2,368 parts In-Stock

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Bristol Electronics

USA . 800 parts In-Stock

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800

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Vyrian

USA . 532 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 916 parts In-Stock

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$0.726

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916

$0.726

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Advanced Electronics

New Zealand . 52 parts In-Stock

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$1.975

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$1.797

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$1.620

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52

$1.975

$1.797

$1.620

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Semicontronic

India . 543 parts In-Stock

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$2.020

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$1.970

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$1.959

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543

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Corohmni

South Africa . 351 parts In-Stock

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$2.380

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Argo Parts USA

USA . 9,128 parts In-Stock

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$2.759

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Netroflash

USA . 500 parts In-Stock

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$2.759

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$2.621

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$2.566

500

$2.759

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$2.621

$2.566

Ampacity Inc.

Singapore . 1,379 parts In-Stock

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$4.400

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Microchip USA

USA . 3,274 parts In-Stock

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$17.936

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Lixinc

USA . 17,281 parts In-Stock

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GreenTree Electronics

Israel . 15,440 parts In-Stock

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RC Electronics

USA . 14,723 parts In-Stock

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$2.940

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$2.770

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$2.720

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$2.720

SupplyDigital Components

Austria . 5,897 parts In-Stock

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Kulean Microsystems

USA . 5,161 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,000 parts In-Stock

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TANS Electronics

Latvia . 2,987 parts In-Stock

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Continental Prestige Electronics

USA . 2,000 parts In-Stock

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$2.390

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$2.300

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Corphita

USA . 1,717 parts In-Stock

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Supply Digital

USA . 1,516 parts In-Stock

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Robosynatics

Brazil . 1,483 parts In-Stock

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$28.771

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$28.771

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Lucentia Tech

USA . 1,483 parts In-Stock

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$28.771

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Perfect Parts

USA . 851 parts In-Stock

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Kepictronics

USA . 722 parts In-Stock

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Problanco Electronics

Mexico . 324 parts In-Stock

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UHIMA Technologies

Türkiye . 148 parts In-Stock

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Overview

Discover the unbeatable quality and reliability of the FDB075N15A-F085 by Onsemi, a leading manufacturer in power Field Effect Transistors (FET). This N-channel transistor with a built-in diode is perfect for switching applications, offering enhanced performance and efficiency. With a high breakdown voltage of 150V and a maximum drain current of 110A, this transistor ensures optimal functionality. Trust in Onsemi's cutting-edge technology and choose the FDB075N15A-F085 for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors generally have better performance characteristics and efficiency compared to P-CHANNEL transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting the transistor from reverse voltage spikes and enhances its functionality in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it highly suitable for use in power control circuits.

Surface Mount: YES

Easy to mount on a circuit board, saving space and allowing for efficient assembly processes.

Minimum DS Breakdown Voltage: 150 V

Can withstand high voltage levels, making it suitable for high-power applications.

Maximum Drain Current (Abs) (ID): 110 A

Capable of carrying high current loads, ideal for power applications where high current is required.

Maximum Power Dissipation (Abs): 333 W

With a high power dissipation rating, this transistor can handle significant power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and fast switching speeds, making it suitable for power applications.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, ensuring reliability in various environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDB075N15A-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

502 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDB075N15A-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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