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FDB0170N607L

Onsemi

FDB0170N607L by Onsemi

FDB0170N607L by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 300A Drain Current, 0.0014 ohm On Resistance, and 250W Power Dissipation in a RECTANGULAR package. Suitable for high-power switching circuits requiring fast turn-on/off times.

Median Price

$3.756

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,400 parts In-Stock

1+ parts

$5.300

100+ parts

$2.530

1k+ parts

$2.320

10k+ parts

-

9,400

$5.300

$2.530

$2.320

-

DigiKey

USA . 846 parts In-Stock

1+ parts

$5.670

100+ parts

$2.700

1k+ parts

$1.999

10k+ parts

$1.980

846

$5.670

$2.700

$1.999

$1.980

Rochester

USA . 1,394 parts In-Stock

1+ parts

-

100+ parts

$1.980

1k+ parts

$1.770

10k+ parts

$1.660

1,394

-

$1.980

$1.770

$1.660

Verical

USA . 379 parts In-Stock

1+ parts

-

100+ parts

-

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$2.212

10k+ parts

$2.075

379

-

-

$2.212

$2.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,045 parts In-Stock

1+ parts

$2.090

100+ parts

-

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3,045

$2.090

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.904

100+ parts

-

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10

$2.904

-

-

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Bristol Electronics

USA . 35 parts In-Stock

1+ parts

$3.420

100+ parts

$1.710

1k+ parts

-

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35

$3.420

$1.710

-

-

IBS Electronics

USA . 67,200 parts In-Stock

1+ parts

-

100+ parts

-

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$5.007

10k+ parts

$4.951

67,200

-

-

$5.007

$4.951

NAC Semi

USA . 49,600 parts In-Stock

1+ parts

-

100+ parts

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$7.140

10k+ parts

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49,600

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-

$7.140

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Vyrian

USA . 15,732 parts In-Stock

1+ parts

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15,732

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Chip Stock

USA . 5,500 parts In-Stock

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5,500

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Cyclops Electronics Ltd

UK . 1,080 parts In-Stock

1+ parts

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1,080

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Flip Electronics

USA . 800 parts In-Stock

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800

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 123 parts In-Stock

1+ parts

$0.320

100+ parts

-

1k+ parts

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10k+ parts

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123

$0.320

-

-

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Semicontronic

India . 16,943 parts In-Stock

1+ parts

$1.870

100+ parts

$1.823

1k+ parts

$1.814

10k+ parts

-

16,943

$1.870

$1.823

$1.814

-

Corohmni

South Africa . 252 parts In-Stock

1+ parts

$1.920

100+ parts

-

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252

$1.920

-

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Corphita

USA . 2,878 parts In-Stock

1+ parts

$1.980

100+ parts

-

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10k+ parts

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2,878

$1.980

-

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.215

100+ parts

$2.016

1k+ parts

$1.816

10k+ parts

-

1,000

$2.215

$2.016

$1.816

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Continental Prestige Electronics

USA . 759 parts In-Stock

1+ parts

$2.904

100+ parts

-

1k+ parts

-

10k+ parts

$2.846

759

$2.904

-

-

$2.846

Argo Parts USA

USA . 749 parts In-Stock

1+ parts

$2.904

100+ parts

-

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-

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749

$2.904

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$2.904

100+ parts

-

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50

$2.904

-

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Ampacity Inc.

Singapore . 17,222 parts In-Stock

1+ parts

$4.070

100+ parts

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17,222

$4.070

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iodParts Technologies Inc.

India . 100,000 parts In-Stock

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Robosynatics

Brazil . 21,599 parts In-Stock

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21,599

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Lucentia Tech

USA . 21,599 parts In-Stock

1+ parts

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100+ parts

$1.494

1k+ parts

$1.464

10k+ parts

$1.464

21,599

-

$1.494

$1.464

$1.464

RC Electronics

USA . 9,200 parts In-Stock

1+ parts

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9,200

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QUARKTWIN TECHNOLOGY LTD

USA . 7,645 parts In-Stock

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7,645

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A-Z Elektronik GmbH

Germany . 6,026 parts In-Stock

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6,026

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TANS Electronics

Latvia . 5,908 parts In-Stock

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Kulean Microsystems

USA . 4,338 parts In-Stock

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4,338

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Alle Elektronik GmbH

Germany . 4,017 parts In-Stock

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4,017

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Problanco Electronics

Mexico . 3,094 parts In-Stock

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3,094

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Microchip USA

USA . 2,049 parts In-Stock

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2,049

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Supply Digital

USA . 1,946 parts In-Stock

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1,946

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ChipstoGo Electronic ltd

UK . 1,080 parts In-Stock

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UHIMA Technologies

Türkiye . 640 parts In-Stock

1+ parts

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640

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SupplyDigital Components

Austria . 478 parts In-Stock

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478

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Overview

Elevate your power management solutions with the FDB0170N607L by Onsemi. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance and reliability in a variety of switching applications. With a maximum operating temperature of 175°C and a maximum drain current of 300A, this transistor is designed to meet your high-power demands with ease. Trust in Onsemi's reputation for quality and innovation, and experience the difference that the FDB0170N607L can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better conductivity and switching speeds compared to P-channel FETs, making them ideal for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from reverse voltage spikes, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient and fast operation in various electronic devices.

Maximum Power Dissipation (Abs): 250 W

Can handle high power dissipation levels, suitable for applications that require high performance and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDB0170N607L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1109 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

300 A

Maximum Drain Current (ID):

300 A

Maximum Drain-Source On Resistance:

.0014 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

340 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1620 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

193 ns

Maximum Turn On Time (ton):

200 ns

Trade Compliance

FDB0170N607L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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