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FDB0105N407L

Onsemi

FDB0105N407L by Onsemi

FDB0105N407L by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 460A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, 2540A Pulsed Drain Current, and 1109mJ Avalanche Energy Rating. Suitable for surface mount with GULL WING terminals, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 175°C.

Median Price

$3.220

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Rochester

USA . 2,853 parts In-Stock

1+ parts

-

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$3.130

1k+ parts

$2.800

10k+ parts

$2.630

2,853

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$3.130

$2.800

$2.630

Verical

USA . 1,600 parts In-Stock

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$3.913

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$3.500

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$3.288

1,600

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$3.913

$3.500

$3.288

Mouser Electronics

USA . 1,555 parts In-Stock

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$3.220

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$3.120

1,555

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$3.220

$3.120

Distributors (In-Stock)

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Digiode

USA . 1,153 parts In-Stock

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$3.296

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1,153

$3.296

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Nova Conductors

Japan . 69 parts In-Stock

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$4.345

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69

$4.345

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Flip Electronics

USA . 3,200 parts In-Stock

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Vyrian

USA . 1,377 parts In-Stock

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Prism Electronics

USA . 922 parts In-Stock

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Cyclops Electronics Ltd

UK . 178 parts In-Stock

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Corohmni

South Africa . 68 parts In-Stock

1+ parts

$0.670

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68

$0.670

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

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$0.780

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300

$0.780

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$2.050

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$1.866

1k+ parts

$1.681

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-

3,000

$2.050

$1.866

$1.681

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Semicontronic

India . 1,646 parts In-Stock

1+ parts

$2.740

100+ parts

$2.672

1k+ parts

$2.658

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1,646

$2.740

$2.672

$2.658

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Ampacity Inc.

Singapore . 1,344 parts In-Stock

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$2.740

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1,344

$2.740

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Corphita

USA . 1,843 parts In-Stock

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$3.123

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$3.123

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Continental Prestige Electronics

USA . 4,536 parts In-Stock

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$4.345

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$4.258

4,536

$4.345

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$4.258

Argo Parts USA

USA . 3,242 parts In-Stock

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$4.345

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Netroflash

USA . 2,000 parts In-Stock

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$4.345

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$4.345

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QUARKTWIN TECHNOLOGY LTD

USA . 14,032 parts In-Stock

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Microchip USA

USA . 9,979 parts In-Stock

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Kulean Microsystems

USA . 7,637 parts In-Stock

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TANS Electronics

Latvia . 5,882 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,564 parts In-Stock

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Lixinc

USA . 4,410 parts In-Stock

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Problanco Electronics

Mexico . 3,719 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,709 parts In-Stock

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SupplyDigital Components

Austria . 3,332 parts In-Stock

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Supply Digital

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 233 parts In-Stock

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GreenTree Electronics

Israel . 100 parts In-Stock

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET)? Look no further than the FDB0105N407L by Onsemi! With its N-channel configuration and built-in diode, this transistor is perfect for switching applications. Boasting a maximum drain current of 460 A and a low on-resistance of 0.0008 ohm, this transistor offers exceptional performance and reliability. Whether you're in the automotive, industrial, or consumer electronics industry, the FDB0105N407L provides the power and efficiency you need. Upgrade your designs with this top-notch transistor from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher mobility, making them more efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient and reliable performance.

Surface Mount: YES

Surface mount capability makes installation easier and saves space on the PCB.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, the transistor can handle higher voltages without breakdown, improving reliability.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient layout on the PCB, saving space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in most applications and require less circuitry for control.

Maximum Pulsed Drain Current (IDM): 2540 A

High maximum pulsed drain current allows the transistor to handle large current spikes without damage.

Avalanche Energy Rating (EAS): 1109 mJ

Higher avalanche energy rating protects the transistor from voltage spikes and surges, increasing its lifespan.

Maximum Drain Current (Abs) (ID): 460 A

High maximum drain current capability allows the transistor to handle high continuous currents.

No. of Terminals: 6

Having 6 terminals provides flexibility in circuit design and connectivity options.

Maximum Power Dissipation (Abs): 300 W

High maximum power dissipation rating ensures the transistor can handle high power levels without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for high-density mounting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low on-resistance for efficient operation.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows the transistor to operate in harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon material provides high reliability and performance for the transistor.

Maximum Turn On Time (ton): 183 ns

Fast turn-on time ensures quick response in switching applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the transistor to operate in cold environments without issues.

Maximum Turn Off Time (toff): 283 ns

Fast turn-off time ensures efficient switching transitions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and thermal conductivity for reliable connections.

Maximum Drain Current (ID): 460 A

High maximum drain current capability allows the transistor to handle high continuous currents.

Maximum Drain-Source On Resistance: 0.0008 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and layout.

Case Connection: DRAIN

Drain connection simplifies circuit design and enhances thermal performance.

Maximum Time At Peak Reflow Temperature (s): 30

A short peak reflow time helps prevent damage to the transistor during soldering.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures reliable solder joints.

Maximum Feedback Capacitance (Crss): 1365 pF

Low feedback capacitance reduces signal distortion and improves high-frequency performance.

Technical Specifications

Power Field Effect Transistors (FET) FDB0105N407L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1109 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

460 A

Maximum Drain Current (ID):

460 A

Maximum Drain-Source On Resistance:

.0008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1365 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

2540 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

283 ns

Maximum Turn On Time (ton):

183 ns

Trade Compliance

FDB0105N407L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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