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FDB0190N807L

Onsemi

FDB0190N807L by Onsemi

FDB0190N807L by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage, ideal for SWITCHING applications. It features 1440A Max Pulsed Drain Current, 777mJ Avalanche Energy Rating, and 0.0017 ohm Max Drain-Source Resistance. This SINGLE configuration transistor operates in ENHANCEMENT MODE with GULL WING terminals and can handle up to 250W power dissipation.

Median Price

$3.170

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bürklin Elektronik

Germany . 800 parts In-Stock

1+ parts

$3.170

100+ parts

-

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-

10k+ parts

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800

$3.170

-

-

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Chip1Stop

Japan . 800 parts In-Stock

1+ parts

$4.561

100+ parts

$3.050

1k+ parts

-

10k+ parts

-

800

$4.561

$3.050

-

-

Mouser Electronics

USA . 6,067 parts In-Stock

1+ parts

$4.810

100+ parts

$3.260

1k+ parts

$2.700

10k+ parts

-

6,067

$4.810

$3.260

$2.700

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DigiKey

USA . 423 parts In-Stock

1+ parts

$5.360

100+ parts

$3.019

1k+ parts

$2.658

10k+ parts

-

423

$5.360

$3.019

$2.658

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Future Electronics

Canada . 49,600 parts In-Stock

1+ parts

-

100+ parts

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$2.550

10k+ parts

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49,600

-

-

$2.550

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Arrow

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.706

10k+ parts

$2.616

800

-

-

$2.706

$2.616

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.699

10k+ parts

$2.609

800

-

-

$2.699

$2.609

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,085 parts In-Stock

1+ parts

$3.012

100+ parts

-

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2,085

$3.012

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-

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Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$3.434

100+ parts

-

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52

$3.434

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TME

Poland . 800 parts In-Stock

1+ parts

$5.130

100+ parts

$4.070

1k+ parts

-

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800

$5.130

$4.070

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NAC Semi

USA . 192,800 parts In-Stock

1+ parts

-

100+ parts

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$5.120

10k+ parts

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192,800

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-

$5.120

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IBS Electronics

USA . 80,000 parts In-Stock

1+ parts

-

100+ parts

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$3.346

10k+ parts

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80,000

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-

$3.346

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Vyrian

USA . 2,592 parts In-Stock

1+ parts

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2,592

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Cyclops Electronics Ltd

UK . 1,600 parts In-Stock

1+ parts

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1,600

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Flip Electronics

USA . 800 parts In-Stock

1+ parts

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800

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Sensible Micro Corp

USA . 144 parts In-Stock

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144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 100 parts In-Stock

1+ parts

$0.528

100+ parts

-

1k+ parts

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100

$0.528

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-

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Advanced Electronics

New Zealand . 191 parts In-Stock

1+ parts

$0.962

100+ parts

$0.875

1k+ parts

$0.789

10k+ parts

-

191

$0.962

$0.875

$0.789

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Corohmni

South Africa . 168 parts In-Stock

1+ parts

$1.710

100+ parts

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168

$1.710

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Ampacity Inc.

Singapore . 2,463 parts In-Stock

1+ parts

$2.170

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2,463

$2.170

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Corphita

USA . 1,997 parts In-Stock

1+ parts

$2.853

100+ parts

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1,997

$2.853

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Continental Prestige Electronics

USA . 4,238 parts In-Stock

1+ parts

$3.230

100+ parts

-

1k+ parts

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$3.165

4,238

$3.230

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-

$3.165

Argo Parts USA

USA . 1,417 parts In-Stock

1+ parts

$3.230

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1,417

$3.230

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Netroflash

USA . 50 parts In-Stock

1+ parts

$3.434

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50

$3.434

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Semicontronic

India . 1,402 parts In-Stock

1+ parts

$4.990

100+ parts

$4.865

1k+ parts

$4.840

10k+ parts

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1,402

$4.990

$4.865

$4.840

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iodParts Technologies Inc.

India . 74,222 parts In-Stock

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74,222

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Kulean Microsystems

USA . 7,593 parts In-Stock

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7,593

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SupplyDigital Components

Austria . 7,100 parts In-Stock

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7,100

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A-Z Elektronik GmbH

Germany . 6,935 parts In-Stock

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6,935

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Alle Elektronik GmbH

Germany . 4,623 parts In-Stock

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4,623

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Lixinc

USA . 3,854 parts In-Stock

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3,854

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Problanco Electronics

Mexico . 2,570 parts In-Stock

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2,570

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Supply Digital

USA . 2,244 parts In-Stock

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2,244

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TANS Electronics

Latvia . 1,904 parts In-Stock

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1,904

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UHIMA Technologies

Türkiye . 690 parts In-Stock

1+ parts

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690

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Overview

Experience the power and efficiency of the FDB0190N807L by Onsemi. Crafted with precision and reliability in mind, this N-CHANNEL Power Field Effect Transistor (FET) is designed for seamless switching applications. With a maximum drain current of 270A and an avalanche energy rating of 777mJ, this transistor offers unparalleled performance and durability. Perfect for various industrial and automotive applications, this product guarantees optimal functionality and value for customers seeking top-tier electronic components. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: NPN AND PNP

Versatile design allows for use in different circuit configurations.

Configuration: COMMON BASE AND COMMON EMITTER, 2 ELEMENTS

Provides flexibility in circuit design and applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring reliable performance in audio or signal amplification.

Surface Mount: YES

Easy to install and suitable for compact circuit designs.

Package Shape: RECTANGULAR

Space-efficient design for easy integration in various electronic devices.

Maximum Power Dissipation (Abs): 0.58 W

Efficient power handling capability for reliable operation.

Minimum DC Current Gain (hFE): 300

High current gain ensures effective signal amplification.

Maximum Operating Temperature: 150 °C

Suitable for operation in a wide range of temperature conditions.

Maximum Collector-Emitter Voltage: 40 V

Sufficient voltage handling capacity for various applications.

Transistor Element Material: SILICON

Provides excellent performance and reliability as a semiconductor material.

Maximum Collector Current (IC): 1 A

High current rating allows for use in circuits with moderate power requirements.

Terminal Finish: TIN

Provides good conductivity and solderability for easy installation.

Maximum Time At Peak Reflow Temperature (s): 30

Soldering process efficiency and reliability ensured during installation.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for robust soldering process.

Technical Specifications

Power Field Effect Transistors (FET) FDB0190N807L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

777 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

270 A

Maximum Drain Current (ID):

270 A

Maximum Drain-Source On Resistance:

.0017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

330 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1440 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

237 ns

Maximum Turn On Time (ton):

221 ns

Trade Compliance

FDB0190N807L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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