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ESD8004MUTAG

Onsemi

ESD8004MUTAG by Onsemi

ESD8004MUTAG by Onsemi is a transient suppression device with 4 common anode elements. It has a breakdown voltage of 7V and operates b/w -55 to 125 °C. Ideal for applications requiring protection against ESD events as per IEC-61000-4-2 standard.

Median Price

$0.489

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

$0.017

100+ parts

$0.015

1k+ parts

$0.014

10k+ parts

-

1,000

$0.017

$0.015

$0.014

-

Arrow

USA . 7,635 parts In-Stock

1+ parts

$0.489

100+ parts

$0.363

1k+ parts

$0.315

10k+ parts

$0.261

7,635

$0.489

$0.363

$0.315

$0.261

Mouser Electronics

USA . 6,239 parts In-Stock

1+ parts

$0.810

100+ parts

$0.490

1k+ parts

$0.348

10k+ parts

$0.271

6,239

$0.810

$0.490

$0.348

$0.271

Verical

USA . 7,635 parts In-Stock

1+ parts

-

100+ parts

$0.363

1k+ parts

$0.315

10k+ parts

$0.261

7,635

-

$0.363

$0.315

$0.261

Chip1Stop

Japan . 2,140 parts In-Stock

1+ parts

-

100+ parts

$0.801

1k+ parts

$0.682

10k+ parts

$0.612

2,140

-

$0.801

$0.682

$0.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,151 parts In-Stock

1+ parts

$0.016

100+ parts

-

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2,151

$0.016

-

-

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Vyrian

USA . 1,169 parts In-Stock

1+ parts

$0.017

100+ parts

-

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1,169

$0.017

-

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Chip Stock

USA . 80,285 parts In-Stock

1+ parts

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80,285

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Flip Electronics

USA . 30,000 parts In-Stock

1+ parts

-

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30,000

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-

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J2 Sourcing AB

Sweden . 3,000 parts In-Stock

1+ parts

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3,000

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Sensible Micro Corp

USA . 1,618 parts In-Stock

1+ parts

-

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1,618

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Prism Electronics

USA . 200 parts In-Stock

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200

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Distributors (Availability)

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Corphita

USA . 1,220 parts In-Stock

1+ parts

$0.015

100+ parts

-

1k+ parts

-

10k+ parts

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1,220

$0.015

-

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.017

100+ parts

$0.015

1k+ parts

$0.014

10k+ parts

-

1,000

$0.017

$0.015

$0.014

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Corohmni

South Africa . 108 parts In-Stock

1+ parts

$0.365

100+ parts

-

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108

$0.365

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Perfect Parts

USA . 13,320 parts In-Stock

1+ parts

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13,320

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Continental Prestige Electronics

USA . 11,115 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.360

10k+ parts

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11,115

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-

$0.360

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Problanco Electronics

Mexico . 7,878 parts In-Stock

1+ parts

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7,878

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A-Z Elektronik GmbH

Germany . 6,068 parts In-Stock

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6,068

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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SupplyDigital Components

Austria . 4,733 parts In-Stock

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4,733

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Alle Elektronik GmbH

Germany . 4,045 parts In-Stock

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4,045

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TANS Electronics

Latvia . 3,078 parts In-Stock

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3,078

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Eastek

USA . 3,000 parts In-Stock

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3,000

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Infinite Electronics LLP (Excess)

. 3,000 parts In-Stock

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3,000

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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3,000

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S.R.D Solutions

India . 2,500 parts In-Stock

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2,500

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Metaverse IC Inc.

Canada . 2,100 parts In-Stock

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2,100

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Northwest PG Solutions

USA . 1,912 parts In-Stock

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1,912

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UHIMA Technologies

Türkiye . 658 parts In-Stock

1+ parts

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658

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Native Components

USA . 280 parts In-Stock

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280

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Kulean Microsystems

USA . 90 parts In-Stock

1+ parts

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100+ parts

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90

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-

Overview

Discover the power of the ESD8004MUTAG by Onsemi, a top-of-the-line Transient Suppression Device designed to protect your electronics from voltage spikes. With its common anode configuration and 4 elements, this device offers unparalleled reliability and performance in a compact package. Trust in Onsemi's reputation for quality and innovation to safeguard your valuable equipment. Whether you're in the automotive, industrial, or consumer electronics industry, the ESD8004MUTAG provides the peace of mind you need. Upgrade to the best in transient suppression technology today and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device, ensuring a longer lifespan.

Nominal Breakdown Voltage: 7 V

Provides effective protection against transient voltage spikes up to 7V, safeguarding sensitive electronic components.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

Reference Standard: IEC-61000-4-2

Complies with industry standards for transient suppression devices, ensuring reliability and performance.

Technical Specifications

Transient Suppression Devices ESD8004MUTAG attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

ULTRA LOW CAPACITANCE

Minimum Breakdown Voltage:

5.5 V

Nominal Breakdown Voltage:

7 V

Maximum Clamping Voltage:

8 V

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

4

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD8004MUTAG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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