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ESD8704MUTAG

Onsemi

ESD8704MUTAG by Onsemi

ESD8704MUTAG by Onsemi is a transient suppression device with 4 common anode elements, operating from -55 to 125°C. It features a max breakdown voltage of 6V and avalanche technology, suitable for applications requiring protection against electrostatic discharge per IEC-61000-4-2 standard.

Median Price

$0.191

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 4 parts In-Stock

1+ parts

$0.597

100+ parts

$0.236

1k+ parts

$0.169

10k+ parts

-

4

$0.597

$0.236

$0.169

-

Mouser Electronics

USA . 19,098 parts In-Stock

1+ parts

$0.610

100+ parts

$0.229

1k+ parts

$0.175

10k+ parts

$0.134

19,098

$0.610

$0.229

$0.175

$0.134

Farnell

UK . 1,686,286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.093

1,686,286

-

-

-

$0.093

Rochester

USA . 1,470,868 parts In-Stock

1+ parts

-

100+ parts

$0.125

1k+ parts

$0.104

10k+ parts

$0.092

1,470,868

-

$0.125

$0.104

$0.092

DigiKey

USA . 1,470,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.160

1,470,868

-

-

-

$0.160

Verical

USA . 1,468,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.116

1,468,037

-

-

-

$0.116

Avnet

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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45,000

-

-

-

-

Element14

Singapore . 4,210 parts In-Stock

1+ parts

-

100+ parts

$0.193

1k+ parts

$0.121

10k+ parts

$0.101

4,210

-

$0.193

$0.121

$0.101

Master Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.201

10k+ parts

$0.104

3,000

-

-

$0.201

$0.104

Chip1Stop

Japan . 238 parts In-Stock

1+ parts

-

100+ parts

$0.191

1k+ parts

$0.174

10k+ parts

-

238

-

$0.191

$0.174

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,465 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

-

10k+ parts

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2,465

$0.088

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.125

100+ parts

-

1k+ parts

-

10k+ parts

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300

$0.125

-

-

-

Vyrian

USA . 363,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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363,738

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-

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-

Chip Stock

USA . 64,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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64,000

-

-

-

-

IBS Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.234

9,000

-

-

-

$0.234

NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.177

6,000

-

-

-

$0.177

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 363,665 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

-

10k+ parts

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363,665

$0.072

-

-

-

Corphita

USA . 1,201 parts In-Stock

1+ parts

$0.084

100+ parts

-

1k+ parts

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10k+ parts

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1,201

$0.084

-

-

-

Corohmni

South Africa . 413 parts In-Stock

1+ parts

$0.091

100+ parts

-

1k+ parts

-

10k+ parts

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413

$0.091

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.122

100+ parts

-

1k+ parts

$0.117

10k+ parts

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500

$0.122

-

$0.117

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Argo Parts USA

USA . 625 parts In-Stock

1+ parts

$0.125

100+ parts

-

1k+ parts

-

10k+ parts

$0.121

625

$0.125

-

-

$0.121

Continental Prestige Electronics

USA . 2,175,286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.109

10k+ parts

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2,175,286

-

-

$0.109

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Futuretech Components

Singapore . 20,000 parts In-Stock

1+ parts

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20,000

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-

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Lixinc

USA . 9,700 parts In-Stock

1+ parts

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9,700

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Problanco Electronics

Mexico . 8,247 parts In-Stock

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8,247

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SupplyDigital Components

Austria . 7,065 parts In-Stock

1+ parts

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7,065

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-

-

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Kulean Microsystems

USA . 5,833 parts In-Stock

1+ parts

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100+ parts

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5,833

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-

-

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TANS Electronics

Latvia . 3,704 parts In-Stock

1+ parts

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3,704

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Kepictronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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UHIMA Technologies

Türkiye . 476 parts In-Stock

1+ parts

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100+ parts

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476

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Overview

Unleash the power of reliable transient suppression with the ESD8704MUTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Transient Suppression Devices that offer unparalleled protection against voltage spikes. This chip carrier package with common anode and four elements is designed for a wide range of applications, ensuring your electronics stay safe and secure. Trust Onsemi to provide cutting-edge technology with superior performance and peace of mind. Experience the difference with the ESD8704MUTAG - the ultimate solution for all your transient suppression needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Config: COMMON ANODE, 4 ELEMENTS

The common anode configuration with 4 elements allows for efficient protection against transient voltage spikes, enhancing the reliability of the connected circuitry.

Surface Mount: YES

The surface-mount capability of this product makes it easy to integrate into circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape of this product makes it easy to place and secure on circuit boards, optimizing space utilization in compact electronic devices.

No. of Terminals: 10

With 10 terminals, this product provides ample connectivity options for various applications, offering flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

The chip carrier package style ensures efficient heat dissipation, making this product suitable for high-power applications that require reliable cooling mechanisms.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures the product can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the product can operate in extreme cold environments, enhancing its versatility in various settings.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and resistance to corrosion, ensuring a reliable electrical connection and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position of this product simplifies installation and maintenance, making it user-friendly for technicians and engineers.

Technical Specifications

Transient Suppression Devices ESD8704MUTAG attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

ULTRA LOW CAPACITANCE

Maximum Breakdown Voltage:

6 V

Config:

COMMON ANODE, 4 ELEMENTS

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N10

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

4

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD8704MUTAG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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