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ESD8040MUTAG

Onsemi

ESD8040MUTAG by Onsemi

ESD8040MUTAG by Onsemi is a surface mount TRANS VOLTAGE SUPPRESSOR DIODE with 5.5V breakdown voltage, 12.9V clamping voltage, and 3.3V peak reverse voltage. It uses AVALANCHE technology for unidirectional polarity protection in transient suppression applications.

Median Price

$1.215

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 429 parts In-Stock

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$0.599

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$0.594

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$0.581

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$0.579

429

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$0.594

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$0.579

Arrow

USA . 2 parts In-Stock

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$0.849

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Farnell

UK . 1 parts In-Stock

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$1.610

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1

$1.610

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Mouser Electronics

USA . 7,101 parts In-Stock

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$1.730

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$1.230

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$0.880

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$0.777

7,101

$1.730

$1.230

$0.880

$0.777

Element14

Singapore . 14 parts In-Stock

1+ parts

$2.650

100+ parts

$1.760

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$1.260

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$1.140

14

$2.650

$1.760

$1.260

$1.140

Rochester

USA . 3,467,370 parts In-Stock

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Verical

USA . 1,977,129 parts In-Stock

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$0.981

1,977,129

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$0.981

DigiKey

USA . 941,043 parts In-Stock

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$1.330

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941,043

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Avnet

USA . 2,834 parts In-Stock

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$0.819

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Distributors (In-Stock)

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Digiode

USA . 231 parts In-Stock

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$0.520

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Nova Conductors

Japan . 600 parts In-Stock

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$1.596

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DigiKey Marketplace

USA . 967,982 parts In-Stock

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$0.900

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Vyrian

USA . 495,103 parts In-Stock

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Chip Stock

USA . 4,500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,337 parts In-Stock

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Netsource Technology, Inc.

USA . 2,914 parts In-Stock

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Bristol Electronics

USA . 2,587 parts In-Stock

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Rebound Electronics

UK . 200 parts In-Stock

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Semtec, LLC

USA . 4 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 111 parts In-Stock

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$0.100

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Corphita

USA . 2,379 parts In-Stock

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$0.492

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2,379

$0.492

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Semicontronic

India . 556,664 parts In-Stock

1+ parts

$0.510

100+ parts

$0.497

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$0.495

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556,664

$0.510

$0.497

$0.495

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Ampacity Inc.

Singapore . 556,598 parts In-Stock

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$0.510

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556,598

$0.510

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Corohmni

South Africa . 284 parts In-Stock

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$0.547

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Aranea Global

USA . 2,000 parts In-Stock

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$1.564

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$1.502

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Argo Parts USA

USA . 3,060 parts In-Stock

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Continental Prestige Electronics

USA . 967,982 parts In-Stock

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$1.040

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Authorized Procurement Solutions

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Lixinc

USA . 12,088 parts In-Stock

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Perfect Parts

USA . 9,261 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,206 parts In-Stock

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Problanco Electronics

Mexico . 4,949 parts In-Stock

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Assy Fe

Spain . 4,688 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,137 parts In-Stock

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Eastek

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,664 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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TANS Electronics

Latvia . 1,688 parts In-Stock

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ChipstoGo Electronic ltd

UK . 1,082 parts In-Stock

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Kulean Microsystems

USA . 391 parts In-Stock

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UHIMA Technologies

Türkiye . 180 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Enhance your electronics with the ESD8040MUTAG by Onsemi, a top-tier manufacturer known for superior quality and reliability. This Transient Suppression Device is designed for peak performance in a variety of applications, offering unparalleled protection against voltage spikes and surges. With its surface mount capability and advanced technology, this product provides customers with peace of mind knowing their devices are safeguarded at all times. Invest in the ESD8040MUTAG today and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy installation on PCBs, making it suitable for applications where space is limited.

Nominal Breakdown Voltage: 5.5 V

Provides protection by limiting the voltage levels that can reach sensitive components, preventing damage from overvoltage events.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and conductivity, enhancing the reliability and performance of the device.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, allowing for efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, ensuring durability and stability during the manufacturing process.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diodes are specifically designed for transient voltage suppression, offering effective protection against voltage spikes and surges.

Technology: AVALANCHE

Avalanche technology provides fast response times and high surge capability, making it ideal for applications requiring robust transient suppression.

Maximum Repetitive Peak Reverse Voltage: 3.3 V

With a low maximum repetitive peak reverse voltage, this device can effectively protect sensitive components without compromising performance.

Polarity: UNIDIRECTIONAL

Unidirectional polarity ensures that the device only conducts in one direction, providing targeted protection against voltage transients.

Maximum Clamping Voltage: 12.9 V

Provides efficient clamping of transient voltages at a relatively low level, safeguarding connected devices from potential damage.

Diode Element Material: SILICON

Silicon diode elements offer high reliability and performance, ensuring long-term protection against transient events.

Technical Specifications

Transient Suppression Devices ESD8040MUTAG attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Nominal Breakdown Voltage:

5.5 V

Maximum Clamping Voltage:

12.9 V

Diode Element Material:

SILICON

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD8040MUTAG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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