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ESD8111FCT5G

Onsemi

ESD8111FCT5G by Onsemi

ESD8111FCT5G by Onsemi is a unidirectional avalanche diode with 7.9V breakdown voltage, 1uA reverse current, and 8V clamping voltage. Ideal for transient suppression in electronic circuits, it operates b/w -55 °C to 150°C and complies with IEC-61000-4-2 standard.

Median Price

$0.150

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,610 parts In-Stock

1+ parts

$0.310

100+ parts

$0.099

1k+ parts

$0.080

10k+ parts

$0.069

7,610

$0.310

$0.099

$0.080

$0.069

Newark

USA . 4,274 parts In-Stock

1+ parts

$0.351

100+ parts

$0.112

1k+ parts

$0.087

10k+ parts

-

4,274

$0.351

$0.112

$0.087

-

Rochester

USA . 1,909,490 parts In-Stock

1+ parts

-

100+ parts

$0.082

1k+ parts

$0.068

10k+ parts

$0.060

1,909,490

-

$0.082

$0.068

$0.060

DigiKey

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

10,000

-

-

-

$0.070

Farnell

UK . 4,794 parts In-Stock

1+ parts

-

100+ parts

$0.188

1k+ parts

$0.180

10k+ parts

$0.177

4,794

-

$0.188

$0.180

$0.177

Element14

Singapore . 4,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.111

10k+ parts

$0.107

4,774

-

-

$0.111

$0.107

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,480 parts In-Stock

1+ parts

$0.064

100+ parts

-

1k+ parts

-

10k+ parts

-

2,480

$0.064

-

-

-

Vyrian

USA . 489 parts In-Stock

1+ parts

$0.067

100+ parts

-

1k+ parts

-

10k+ parts

-

489

$0.067

-

-

-

Chip Stock

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

70,000

-

-

-

-

Flip Electronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Contempo Components LLC

USA . 122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

122

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,354 parts In-Stock

1+ parts

$0.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

$0.060

-

-

-

Corohmni

South Africa . 252 parts In-Stock

1+ parts

$0.067

100+ parts

-

1k+ parts

-

10k+ parts

-

252

$0.067

-

-

-

Component Stockers USA

USA . 22,908 parts In-Stock

1+ parts

$0.070

100+ parts

$0.060

1k+ parts

$0.060

10k+ parts

$0.060

22,908

$0.070

$0.060

$0.060

$0.060

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.144

100+ parts

$0.142

1k+ parts

$0.137

10k+ parts

-

100

$0.144

$0.142

$0.137

-

Native Components

USA . 867 parts In-Stock

1+ parts

$705.550

100+ parts

$691.439

1k+ parts

$684.383

10k+ parts

$677.328

867

$705.550

$691.439

$684.383

$677.328

Northwest PG Solutions

USA . 556 parts In-Stock

1+ parts

$776.105

100+ parts

-

1k+ parts

-

10k+ parts

-

556

$776.105

-

-

-

Problanco Electronics

Mexico . 7,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,975

-

-

-

-

TANS Electronics

Latvia . 4,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,872

-

-

-

-

A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Kulean Microsystems

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

800

-

-

-

-

SupplyDigital Components

Austria . 723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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723

-

-

-

-

UHIMA Technologies

Türkiye . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

260

-

-

-

-

Overview

Enhance your electronic devices with the ESD8111FCT5G by Onsemi, a top-tier manufacturer known for quality and reliability. As a Transient Suppression Device, this product offers superior protection against voltage spikes and surges, ensuring the longevity of your equipment. With a bidirectional polarity and a maximum clamping voltage of 8V, this chip carrier style device is ideal for a wide range of applications. Trust Onsemi to deliver cutting-edge technology that provides peace of mind for your electronics. Elevate your devices with the ESD8111FCT5G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material makes the device durable and ensures it can withstand various environmental conditions.

Nominal Breakdown Voltage: 7.9 V

The nominal breakdown voltage of 7.9 V ensures effective protection against voltage surges or spikes, making it suitable for a wide range of applications.

Maximum Reverse Current: 1 uA

The low maximum reverse current of 1 uA indicates efficient operation and minimal power consumption, making it a reliable choice for transient suppression.

Minimum Operating Temperature: -55 °C

The wide minimum operating temperature range of -55 °C allows the device to function effectively in extreme cold conditions, providing reliable transient suppression.

Maximum Clamping Voltage: 8 V

The maximum clamping voltage of 8 V ensures that the voltage levels do not exceed a safe limit, effectively protecting connected devices from damage during transient events.

Technical Specifications

Transient Suppression Devices ESD8111FCT5G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

LOW CAPACITANCE

Maximum Breakdown Voltage:

8.6 V

Minimum Breakdown Voltage:

5.5 V

Nominal Breakdown Voltage:

7.9 V

Maximum Clamping Voltage:

8 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Maximum Reverse Current:

1 uA

Reverse Test Voltage:

3.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESD8111FCT5G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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