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BSP50

Onsemi

BSP50 by Onsemi

BSP50 by Onsemi is a NPN BJT with 1W power dissipation, hFE of 2000, and IC of 0.0008A. Ideal for small outline applications, it operates up to 150 °C and features a GULL WING terminal form for surface mount assembly.

Median Price

$0.221

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 80,000 parts In-Stock

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Farnell

UK . 3,900 parts In-Stock

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$0.262

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DigiKey

USA . 3,575 parts In-Stock

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$0.250

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$0.250

Rochester

USA . 3,225 parts In-Stock

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$0.192

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$0.159

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$0.142

3,225

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$0.192

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Verical

USA . 3,225 parts In-Stock

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$0.178

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Distributors (In-Stock)

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Digiode

USA . 3,971 parts In-Stock

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$0.157

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Flip Electronics

USA . 64,000 parts In-Stock

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Legend Electronics Inc.

USA . 30,000 parts In-Stock

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Vyrian

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LIBRA Elektronik GmbH

Germany . 3,864 parts In-Stock

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ComSIT USA

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ComSIT Distribution GmbH

Germany . 2,600 parts In-Stock

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Anansix

USA . 1,948 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 1,431 parts In-Stock

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Goldney Electronics S.L.

Spain . 900 parts In-Stock

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Zilex Electronics Inc.

Canada . 838 parts In-Stock

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Pegasus Components GmbH

Germany . 461 parts In-Stock

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Electronic Expediters

USA . 23 parts In-Stock

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Cogito LLC

Ukraine . 3 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,108 parts In-Stock

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$0.148

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Corohmni

South Africa . 281 parts In-Stock

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$0.165

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AZTECH Wire

Italy . 3,053 parts In-Stock

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$0.210

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$0.210

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Modulus Dynamics

Lithuania . 20,885 parts In-Stock

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$1.576

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$1.513

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$1.450

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$1.576

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Microchip USA

USA . 2,598 parts In-Stock

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$4.550

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Northwest PG Solutions

USA . 3,734 parts In-Stock

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$14.492

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$13.043

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Kepictronics

USA . 21,337 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 9,200 parts In-Stock

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Problanco Electronics

Mexico . 8,270 parts In-Stock

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UNI Independent Distributors

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SupplyDigital Components

Austria . 5,689 parts In-Stock

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TANS Electronics

Latvia . 5,114 parts In-Stock

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Continental Prestige Electronics

USA . 3,900 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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A-Plus Industry Inc.

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Supply Digital

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Assy Fe

Spain . 1,970 parts In-Stock

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Native Components

USA . 1,965 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,840 parts In-Stock

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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Kulean Microsystems

USA . 338 parts In-Stock

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Overview

Unleash the power of innovation with the BSP50 by Onsemi. This small signal bipolar junction transistor offers top-notch quality and reliability, thanks to its manufacturer's commitment to excellence. Ideal for a wide range of applications, this NPN transistor provides exceptional performance in a compact package, making it a versatile solution for your electronic projects. Experience the value, benefits, and advantages that the BSP50 brings to the table, and elevate your creations to new heights. Choose Onsemi for reliability you can trust and performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, offering versatility in circuit design.

Configuration: SINGLE

Simplified setup and usage, making it easier for integration into circuits.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Space-efficient design that optimizes PCB layout and allows for compact circuit designs.

Maximum Power Dissipation (Abs): 1 W

Can handle high power dissipation, making it suitable for applications requiring greater power output.

Minimum DC Current Gain (hFE): 2000

High DC current gain ensures reliable and consistent amplification performance.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, suitable for applications where heat dissipation is a concern.

Transistor Element Material: SILICON

Silicon transistors offer high performance, durability, and stability in various applications.

Maximum Collector Current (IC): 0.0008 A

Suitable for low to medium current applications, providing efficient operation within specified limits.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant terminal finish for secure connections.

Terminal Position: DUAL

Dual terminal position allows for flexible circuit board layouts and efficient wiring connections.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures safe and efficient soldering process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature for effective soldering and secure mounting on PCBs.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BSP50 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Configuration:

Minimum DC Current Gain (hFE):

2000

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

1 W

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

BSP50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5315-01-420-3934, 5315014203934

NIIN

014203934

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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