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BF493SRL1

Onsemi

BF493SRL1 by Onsemi

BF493SRL1 by Onsemi is a PNP BJT with max. collector-emitter voltage of 350V, max. collector current of 0.5A, and min. DC current gain of 40 (hFE). Ideal for amplifier applications due to its cylindrical package style and silicon transistor element material, operating up to 150 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 2,339 parts In-Stock

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Digiode

USA . 2,137 parts In-Stock

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Native Components

USA . 648 parts In-Stock

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$9.220

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Northwest PG Solutions

USA . 695 parts In-Stock

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$9.127

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TANS Electronics

Latvia . 8,257 parts In-Stock

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Problanco Electronics

Mexico . 6,297 parts In-Stock

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SupplyDigital Components

Austria . 3,241 parts In-Stock

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Kulean Microsystems

USA . 1,973 parts In-Stock

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Corphita

USA . 1,744 parts In-Stock

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Corohmni

South Africa . 408 parts In-Stock

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UHIMA Technologies

Türkiye . 388 parts In-Stock

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Overview

Enhance your electronic projects with the BF493SRL1 by Onsemi, a top-tier manufacturer known for their superior quality components. This Small Signal Bipolar Junction Transistor (BJT) boasts a PNP polarity and is perfect for amplifier applications. With a maximum power dissipation of 0.625W and a maximum collector-emitter voltage of 350V, this transistor offers exceptional performance and reliability. Whether you're a hobbyist or a professional, this product's high DC current gain of 40 and peak reflow temperature of 235 °C ensure optimal results. Upgrade your circuits today with the BF493SRL1 and experience the difference in quality and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and more versatile than other alternatives, making it suitable for a wide range of applications.

Polarity or Channel Type: PNP

PNP transistors are commonly used in amplifier circuits, which enhances the performance of audio signals.

Configuration: SINGLE

Single configuration transistors are easier to use and require less circuitry, making them more efficient in amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and efficiency in signal amplification.

Maximum Power Dissipation (Abs): 0.625 W

With a maximum power dissipation of 0.625 W, this transistor can handle higher power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 150 °C

Operating at temperatures up to 150 °C allows this transistor to withstand high temperatures without compromising performance, making it suitable for various environments.

Maximum Collector-Emitter Voltage: 350 V

The high collector-emitter voltage rating of 350 V ensures reliable operation even in high voltage applications, improving overall versatility.

Maximum Collector Current (IC): 0.5 A

With a maximum collector current of 0.5 A, this transistor can handle moderate current levels, making it suitable for a wide range of applications.

Nominal Transition Frequency (fT): 50 MHz

The high nominal transition frequency of 50 MHz ensures fast switching speeds, making this transistor suitable for high-frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) BF493SRL1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

350 V

Configuration:

Minimum DC Current Gain (hFE):

40

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BF493SRL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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