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ASM3I1819NG-08-ST

Onsemi

ASM3I1819NG-08-ST by Onsemi

ASM3I1819NG-08-ST by Onsemi is a Clock Generator with 40 MHz output frequency, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and has a small outline package style. With 8 terminals in a rectangular shape, it is designed for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,423 parts In-Stock

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1,423

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Vyrian

USA . 464 parts In-Stock

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464

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 562 parts In-Stock

1+ parts

$0.434

100+ parts

-

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$0.417

562

$0.434

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$0.417

Northwest PG Solutions

USA . 2,299 parts In-Stock

1+ parts

$0.478

100+ parts

-

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$0.421

2,299

$0.478

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$0.421

TANS Electronics

Latvia . 7,250 parts In-Stock

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7,250

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SupplyDigital Components

Austria . 5,547 parts In-Stock

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5,547

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Corphita

USA . 411 parts In-Stock

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411

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Corohmni

South Africa . 334 parts In-Stock

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334

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UHIMA Technologies

Türkiye . 295 parts In-Stock

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295

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Problanco Electronics

Mexico . 268 parts In-Stock

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Kulean Microsystems

USA . 91 parts In-Stock

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Overview

Enhance your electronic designs with the ASM3I1819NG-08-ST clock generator by Onsemi. Crafted with precision and quality, this clock generator offers unmatched reliability and performance. Ideal for a wide range of applications, this product is a game-changer in the world of technology. Experience seamless integration, improved efficiency, and unparalleled functionality with this innovative solution. Elevate your projects to new heights with the ASM3I1819NG-08-ST by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easier PCB assembly and saves space on the board.

Maximum Output Clock Frequency: 40 MHz

High maximum output clock frequency enables reliable performance in demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Peripheral IC Type: CLOCK GENERATOR, VIDEO

The clock generator capability combined with video features makes this product versatile for various applications.

Nominal Supply Voltage: 3.3 V

This standard voltage requirement is common in many electronic systems, ensuring compatibility.

Technical Specifications

Clock Generators ASM3I1819NG-08-ST attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

40 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

40 MHz

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

ASM3I1819NG-08-ST Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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