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ASM3I1819NF-08-SR

Onsemi

ASM3I1819NF-08-SR by Onsemi

ASM3I1819NF-08-SR by Onsemi is a Clock Generator with 40 MHz output frequency, suitable for industrial applications. It features 8 terminals, operates b/w -40 to 85 °C, and has a small outline package style. Ideal for video peripheral ICs requiring a 3.3 V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 726 parts In-Stock

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Vyrian

USA . 322 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 699 parts In-Stock

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$2.048

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699

$2.048

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Northwest PG Solutions

USA . 266 parts In-Stock

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$2.253

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Kulean Microsystems

USA . 8,330 parts In-Stock

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Problanco Electronics

Mexico . 8,161 parts In-Stock

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SupplyDigital Components

Austria . 4,846 parts In-Stock

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Corphita

USA . 2,155 parts In-Stock

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Corohmni

South Africa . 475 parts In-Stock

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475

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TANS Electronics

Latvia . 331 parts In-Stock

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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Overview

Enhance your electronic devices with the ASM3I1819NF-08-SR clock generator from Onsemi. Renowned for their top-notch quality and reliability, Onsemi delivers superior performance in the realm of clock generators. This versatile product is perfect for a wide range of applications, offering precision timing solutions for various electronic systems. With its compact design and advanced technology, the ASM3I1819NF-08-SR provides customers with unparalleled value and benefits, ensuring optimal functionality and efficiency in their projects. Elevate your creations with this exceptional clock generator from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable devices.

Maximum Output Clock Frequency: 40 MHz

The high maximum output clock frequency of 40 MHz ensures reliable and accurate timing for various applications.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures the product can withstand industrial environments and extended usage.

Technology: CMOS

The CMOS technology used in the clock generator provides low power consumption and high noise immunity, resulting in efficient operation.

Technical Specifications

Clock Generators ASM3I1819NF-08-SR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

40 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

40 MHz

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

ASM3I1819NF-08-SR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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