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ASM3I2508AF-08ST

Onsemi

ASM3I2508AF-08ST by Onsemi

ASM3I2508AF-08ST by Onsemi is a Clock Generator with 3.3V supply, 60mA current, and -40 to 85 °C operating temp. Ideal for industrial applications requiring precise clock signal generation in compact SMD packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 196 parts In-Stock

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Vyrian

USA . 165 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 552 parts In-Stock

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$9.220

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552

$9.220

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Northwest PG Solutions

USA . 2,211 parts In-Stock

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$10.142

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$9.128

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TANS Electronics

Latvia . 8,351 parts In-Stock

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8,351

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Problanco Electronics

Mexico . 4,572 parts In-Stock

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SupplyDigital Components

Austria . 3,293 parts In-Stock

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Kulean Microsystems

USA . 2,074 parts In-Stock

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Corphita

USA . 1,354 parts In-Stock

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UHIMA Technologies

Türkiye . 721 parts In-Stock

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Corohmni

South Africa . 346 parts In-Stock

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Overview

Enhance your electronic designs with the ASM3I2508AF-08ST clock generator by Onsemi. Known for their superior quality and reliability, Onsemi products are trusted by industry professionals worldwide. This clock generator is versatile and suitable for a wide range of applications, offering customers the value of precise timing control and synchronization. With its compact design and advanced technology, this product ensures optimal performance in industrial settings. Experience the benefits of seamless integration and enhanced functionality with the ASM3I2508AF-08ST from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, compatible with many systems and devices.

Package Style (Meter): SMALL OUTLINE

Compact small outline package design saves space on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range ensures reliable operation in various environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Maximum Supply Current: 60 mA

Low maximum supply current requirement helps in reducing power consumption and improving efficiency.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm allows for easy connectivity with other components on the circuit board.

Technical Specifications

Clock Generators ASM3I2508AF-08ST attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Current:

60 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

ASM3I2508AF-08ST Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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