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ASM3I1819NF-08-TR

Onsemi

ASM3I1819NF-08-TR by Onsemi

ASM3I1819NF-08-TR by Onsemi is a Clock Generator with 40 MHz max output frequency, suitable for industrial applications. It features a small outline package, CMOS technology, and operates b/w -40 to 85 °C. Ideal for video peripheral ICs requiring 3.3 V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,232 parts In-Stock

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Vyrian

USA . 43 parts In-Stock

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SupplyDigital Components

Austria . 7,607 parts In-Stock

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TANS Electronics

Latvia . 3,480 parts In-Stock

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Northwest PG Solutions

USA . 2,278 parts In-Stock

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Problanco Electronics

Mexico . 1,363 parts In-Stock

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Corphita

USA . 830 parts In-Stock

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Kulean Microsystems

USA . 512 parts In-Stock

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Native Components

USA . 492 parts In-Stock

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Corohmni

South Africa . 262 parts In-Stock

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UHIMA Technologies

Türkiye . 125 parts In-Stock

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Overview

Unleash the power of precision timing with the ASM3I1819NF-08-TR by Onsemi. As a leading manufacturer in clock generators, Onsemi delivers unparalleled quality and reliability in every product. This clock generator is perfect for a wide range of applications, providing customers with seamless synchronization and optimal performance. With its compact design and industrial-grade temperature rating, the ASM3I1819NF-08-TR offers exceptional value, benefits, and advantages that will elevate your projects to new heights. Trust Onsemi to keep you on time, every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and cost-effectiveness for the clock generator.

Surface Mount: YES

Easy installation and flexibility in circuit board design.

Maximum Output Clock Frequency: 40 MHz

High speed clock generation capabilities for various applications.

No. of Terminals: 8

Sufficient terminals for connecting to other components in the circuit.

Maximum Operating Temperature: 85 °C

Wide temperature range for operation in various environments.

Minimum Operating Temperature: -40 °C

Ability to function in extreme low temperature conditions.

Technology: CMOS

Low power consumption and compatibility with a wide range of devices.

Nominal Supply Voltage: 3.3 V

Standard voltage requirement for many electronic systems.

Technical Specifications

Clock Generators ASM3I1819NF-08-TR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

40 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Nominal Primary Clock/Crystal Frequency:

40 MHz

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Peripheral IC Type:

Trade Compliance

ASM3I1819NF-08-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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