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LMK04832NKDR

Texas Instruments

LMK04832NKDR by Texas Instruments

LMK04832NKDR by Texas Instruments is a clock generator with a max output frequency of 3255 MHz. It operates in industrial temperature range (-40 to 85 °C) and has 64 terminals in a square package style. Ideal for applications requiring precise timing such as telecommunications and networking equipment.

Median Price

$25.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

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$25.630

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Chip Stock

USA . 11,200 parts In-Stock

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Vyrian

USA . 5,968 parts In-Stock

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Digiode

USA . 4,917 parts In-Stock

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One Stop Electronics

USA . 1,013 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 543 parts In-Stock

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$10.573

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Semicontronic

India . 1,325 parts In-Stock

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$18.000

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$17.550

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$17.460

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Ampacity Inc.

Singapore . 907 parts In-Stock

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$24.000

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907

$24.000

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Continental Prestige Electronics

USA . 1,689 parts In-Stock

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$25.630

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$25.117

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Netroflash

USA . 1,000 parts In-Stock

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$25.630

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$24.348

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$23.836

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$23.836

Parana Technologies

USA . 471 parts In-Stock

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$68.939

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DigiPath Technology Company

USA . 2,194 parts In-Stock

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$75.911

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$69.838

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ChromeModa Solutions

Germany . 5,845 parts In-Stock

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$77.460

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$63.517

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IDEA Electronic Components Group

UK . 1,996 parts In-Stock

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$77.460

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$73.587

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$69.714

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Corohmni

South Africa . 247 parts In-Stock

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$77.584

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Kepictronics

USA . 9,000 parts In-Stock

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Lixinc

USA . 8,543 parts In-Stock

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Perfect Parts

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Argo Parts USA

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Component Stockers USA

USA . 246 parts In-Stock

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Overview

Elevate your design with the LMK04832NKDR clock generator by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. Clock generators are essential components in various applications such as telecommunications, networking, and industrial automation. The LMK04832NKDR offers exceptional value with its high-performance capabilities, ensuring stable and precise clock signals for your system. Upgrade your project today with the LMK04832NKDR and experience the benefits of superior performance and accuracy.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and enabling efficient assembly.

Maximum Supply Voltage: 3.45 V

Ensures compatibility with a wide range of power sources, providing flexibility in electronic designs.

Package Shape: SQUARE

Square shape enables uniform heat dissipation and efficient use of space on the PCB.

Maximum Output Clock Frequency: 3255 MHz

High output frequency allows for precise timing in systems requiring fast clock signals.

No. of Terminals: 64

Sufficient number of terminals for connecting to various components in a complex electronic system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles allows for different mounting options based on the specific requirements of the application.

Minimum Supply Voltage: 3.15 V

Provides a safe operating range for the device while ensuring stable performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the product suitable for industrial applications with varying environmental conditions.

Minimum Operating Temperature: -40 °C

Capability to operate in low temperature environments without affecting performance.

Terminal Finish: Matte Tin (Sn)

Matte tin finish offers reliable contact points for terminals, enhancing signal integrity.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and efficient signal routing.

Maximum Seated Height: 0.8 mm

Low profile design enables compact integration into electronic systems with limited space.

Width: 9 mm

Standard width dimension for easy placement on a PCB and compatibility with standard board sizes.

Length: 9 mm

Standard length dimension for easy integration into electronic assemblies.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Versatile clock generator supporting various peripheral IC types for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures long-term reliability.

Maximum Supply Current: 1120 mA

High supply current capability for driving multiple components and ensuring stable operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance in electronic systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise connections and compact PCB layout.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during assembly and operation.

Nominal Primary Clock/Crystal Frequency: 250 MHz

Nominal frequency suitable for a wide range of clock and crystal-based applications.

Technical Specifications

Clock Generators LMK04832NKDR attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

3255 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Nominal Primary Clock/Crystal Frequency:

250 MHz

Maximum Seated Height:

.8 mm

Maximum Supply Current:

1120 mA

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LMK04832NKDR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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