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DSC557-0334FI1-T

Microchip Technology

DSC557-0334FI1-T by Microchip Technology

DSC557-0334FI1-T by Microchip Technology is a clock generator with a max output frequency of 460 MHz. Operating b/w -40 to 85°C, it has a supply voltage range of 2.25V to 3.6V and draws a max current of 23mA. Ideal for applications requiring precise timing in compact spaces.

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Nova Conductors

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AZTECH Wire

Italy . 1,096 parts In-Stock

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Overview

Elevate your electronics with the cutting-edge DSC557-0334FI1-T by Microchip Technology - a superior clock generator that delivers precision, reliability, and innovation. Perfectly designed for a wide range of applications, this surface-mount device boasts a maximum output clock frequency of 460 MHz, ensuring seamless performance in any setting. With Microchip Technology's renowned reputation for quality and excellence, you can trust that this clock generator will exceed your expectations. Say goodbye to downtime and hello to seamless operations with the DSC557-0334FI1-T. Upgrade today and experience unmatched value and efficiency like never before.

Feature Benefit Bullets

Surface Mount: YES

Easy to integrate onto PCBs and saves space, ideal for compact designs.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, providing a wider operating range.

Package Shape: RECTANGULAR

Standard package shape for easy handling and compatibility with assembly processes.

Maximum Output Clock Frequency: 460 MHz

High-frequency output enables fast signal generation for various applications.

No. of Terminals: 14

Provides flexibility for connecting to multiple components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Different package styles offer versatility in mounting and thermal management options.

Minimum Supply Voltage: 2.25 V

Can operate at low supply voltages, conserving power and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

Operates in cold conditions, making it suitable for wide temperature range applications.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection with other components.

Maximum Seated Height: 0.9 mm

Low profile design enables compact product size and efficient PCB layout.

Width: 2.5 mm

Narrow width saves space on the PCB and facilitates tight integration.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand reflow soldering process for a specified time, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

Can handle high reflow temperatures, compatible with lead-free soldering processes.

Length: 3.2 mm

Compact length for space-constrained designs and efficient PCB layout.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Specialized IC for clock generation applications, ensuring precise timing and synchronization.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for digital circuits.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces soldering issues.

Maximum Supply Current: 23 mA

Low supply current consumption for power-efficient operation and extended battery life.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage for stable operation and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense packing of components and saves board space.

Technical Specifications

Clock Generators DSC557-0334FI1-T attributes and parameters. Explore more Clock Generators devices from Microchip Technology

Specs

Additional Features:

ELIMINATED THE EXT QUARTZ CRYSTAL AND USED MEMS CLOCK GENERATORS AS EXT CLOCK

JESD-30 Code:

R-XQCC-N14

Length:

3.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

460 MHz

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Current:

23 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

2.5 mm

Peripheral IC Type:

Trade Compliance

DSC557-0334FI1-T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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