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LMK04832MPAPSEP

Texas Instruments

LMK04832MPAPSEP by Texas Instruments

LMK04832MPAPSEP clock generator by Texas Instruments operates at a max output frequency of 3255 MHz. It features a 64-terminal package with a square shape and is designed for applications requiring precise jitter attenuation. With a supply voltage range of 3.135V to 3.465V, it can function in temperatures ranging from -55°C to 125°C.

Median Price

$22,646.780

Lifecycle Status

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5

In-Stock Inventory

1k+

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Texas Instruments

USA . 553 parts In-Stock

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$20,000.000

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Chip1Stop

Japan . 40 parts In-Stock

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$25,293.560

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Digiode

USA . 2,020 parts In-Stock

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$19,000.000

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Nova Conductors

Japan . 41 parts In-Stock

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Vyrian

USA . 52 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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$0.020

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AZTECH Wire

Italy . 323 parts In-Stock

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$14.882

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Semicontronic

India . 297 parts In-Stock

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$17,000.000

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$16,575.000

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$16,490.000

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$17,000.000

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Corphita

USA . 2,266 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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$18,816.000

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Continental Prestige Electronics

USA . 3,712 parts In-Stock

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Argo Parts USA

USA . 2,089 parts In-Stock

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$20,000.000

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$19,800.000

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$19,600.000

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$19,400.000

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Overview

Texas Instruments LMK0482x Ultra-Low-Noise Synthesizer and Jitter Cleaner high-performance with JEDEC JESD204B support. The 14 clock outputs from PLL2 can be configured to drive seven JESD204B converters or other logic devices using the device and SYSREF clocks. SYSREF can be provided using both DC and AC coupling. Not limited to JESD204B applications, each of the 14 outputs can be individually configured as high-performance outputs for traditional clocking systems. Features include the ability to trade-off between power or performance, dual VCOs, dynamic digital delay, holdover, and glitchless analog delay. These features make the LMK0482x family ideal for providing flexible high-performance clocking trees. The LMK0482x-EP devices feature gold bond wires, a temperature range of -55°C to +105°C, and include an SnPb lead finish.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.465 V

Allows for reliable operation within the specified voltage range.

Package Shape: SQUARE

Square shape is compact and space-saving, suitable for modern electronic designs.

Maximum Output Clock Frequency: 3255 MHz

High output clock frequency for precise timekeeping and synchronization in electronic systems.

No. of Terminals: 64

Sufficient number of terminals for connecting to various components in a circuit.

Minimum Supply Voltage: 3.135 V

Allows for reliable operation even at lower voltage levels, increasing flexibility.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without risk of malfunctioning.

Minimum Operating Temperature: -55 °C

Can operate in low-temperature environments without risk of malfunctioning.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable connections.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with most electronic systems.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture, ensuring reliability in various environments.

Nominal Primary Clock/Crystal Frequency: 6400 MHz

High-frequency clock/crystal for accurate timekeeping and synchronization in electronic systems.

Technical Specifications

Clock Generators LMK04832MPAPSEP attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Clock Frequency:

3255 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

6400 MHz

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LMK04832MPAPSEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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