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ASM3I2590AG-06-OR

Onsemi

ASM3I2590AG-06-OR by Onsemi

ASM3I2590AG-06-OR by Onsemi is a Clock Generator with 120 MHz output frequency, operating temperature range of -40 to 85 °C. It has 6 terminals, CMOS technology, and is ideal for industrial applications requiring precise clock generation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,417 parts In-Stock

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Vyrian

USA . 442 parts In-Stock

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Native Components

USA . 812 parts In-Stock

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$1.200

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812

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Northwest PG Solutions

USA . 1,707 parts In-Stock

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$1.320

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Kulean Microsystems

USA . 6,867 parts In-Stock

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Problanco Electronics

Mexico . 4,185 parts In-Stock

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SupplyDigital Components

Austria . 3,541 parts In-Stock

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TANS Electronics

Latvia . 3,101 parts In-Stock

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Corohmni

South Africa . 444 parts In-Stock

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Corphita

USA . 324 parts In-Stock

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UHIMA Technologies

Türkiye . 259 parts In-Stock

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Overview

Elevate your electronic devices with the ASM3I2590AG-06-OR clock generator by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers cutting-edge solutions in the field of clock generators. Perfect for a wide range of applications, this product offers unparalleled value to customers looking to enhance the performance of their devices. Say goodbye to technical headaches and hello to seamless operation with the ASM3I2590AG-06-OR clock generator from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the clock generator easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 2.625 V

This range allows for flexibility in powering the device while ensuring optimal performance and reliability.

Package Shape: RECTANGULAR

The rectangular shape is a common and space-efficient design for components, making it easy to integrate into various systems.

Maximum Output Clock Frequency: 120 MHz

With a high output frequency, this clock generator can support a wide range of applications requiring precise and synchronized timing.

No. of Terminals: 6

Having a sufficient number of terminals allows for easy connectivity and integration with other components in the system.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

This compact package style saves valuable board space and enables high-density mounting, making it suitable for compact electronic devices.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures that the device can operate efficiently in low-power applications, conserving energy.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this clock generator can withstand harsh environmental conditions and maintain stable performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in both extremely hot and cold environments, making it suitable for industrial applications.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and easy connection, enhancing the overall reliability and functionality of the clock generator.

Maximum Seated Height: 1 mm

The low seated height of the package minimizes the overall profile of the device, making it suitable for slim and compact designs.

Width: 1.6 mm

The narrow width of the package contributes to space-saving on the PCB and enables high-density mounting in electronic systems.

Length: 2.9 mm

The compact length of the package ensures compatibility with various board sizes and allows for efficient placement in tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this clock generator can operate reliably in demanding environments with temperature fluctuations and extreme conditions.

Peripheral IC Type: CLOCK GENERATOR, OTHER

This clock generator is specifically designed to generate precise clock signals for various peripheral devices, enhancing system performance and stability.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the clock generator efficient and reliable in operation.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering during PCB assembly, ensuring a secure connection for reliable performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage optimizes the performance of the clock generator while ensuring compatibility with standard power sources.

Terminal Pitch: 0.95 mm

The small terminal pitch allows for high-density mounting on the PCB, increasing the overall functionality and versatility of the clock generator.

Nominal Primary Clock/Crystal Frequency: 120 MHz

The high nominal frequency enables precise clock signal generation for various applications, ensuring accurate timing and synchronization within the system.

Technical Specifications

Clock Generators ASM3I2590AG-06-OR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOM SUPPLY

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

120 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Nominal Primary Clock/Crystal Frequency:

120 MHz

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

ASM3I2590AG-06-OR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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