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CY22393FXCT

Infineon Technologies

CY22393FXCT by Infineon Technologies

CY22393FXCT clock generator by Infineon operates at a max frequency of 200MHz with supply voltage of 3.3V. It is used in commercial applications, featuring a small outline package style and dual terminal position for easy integration into systems requiring precise timing control.

Median Price

$19.856

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 4,002 parts In-Stock

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Rochester

USA . 2,448 parts In-Stock

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$17.650

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$15.790

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$14.860

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$15.790

$14.860

Verical

USA . 2,448 parts In-Stock

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$22.063

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$19.738

10k+ parts

$18.575

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$19.738

$18.575

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Digiode

USA . 979 parts In-Stock

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$16.938

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Chip Stock

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Vyrian

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Sensible Micro Corp

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Nova Conductors

Japan . 94 parts In-Stock

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Ampacity Inc.

Singapore . 3,072 parts In-Stock

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$15.160

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$15.160

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Semicontronic

India . 3,016 parts In-Stock

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$15.160

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$14.781

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$14.705

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$15.160

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$14.705

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Corphita

USA . 957 parts In-Stock

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$16.047

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$16.047

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Corohmni

South Africa . 768 parts In-Stock

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$22.784

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768

$22.784

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Modulus Dynamics

Lithuania . 2,071 parts In-Stock

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$24.534

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$23.553

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$22.571

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$24.534

$23.553

$22.571

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Aztec Data Supply Inc.

USA . 236 parts In-Stock

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$31.896

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QUARKTWIN TECHNOLOGY LTD

USA . 24,439 parts In-Stock

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Lixinc

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Continental Prestige Electronics

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Kepictronics

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Infinite Electronics LLP (Excess)

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Alle Elektronik GmbH

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Argo Parts USA

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GreenTree Electronics

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Speed Components Ltd (Excess)

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Overview

Enhance your electronic devices with the CY22393FXCT Clock Generator from Infineon Technologies. Crafted with precision and expertise, this clock generator offers unparalleled performance and reliability. Ideal for a wide range of applications, this product ensures seamless operation and precise timing for your projects. Trust in the quality and innovation of Infineon Technologies to bring value and efficiency to your designs. Upgrade your electronics with the CY22393FXCT and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this clock generator lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on the PCB.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage ensures reliable operation and compatibility with various systems.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design for efficient use of space on the board.

Maximum Output Clock Frequency: 200 MHz

With a high maximum output clock frequency, this clock generator is suitable for high-performance applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard voltage requirements in electronic systems.

No. of Terminals: 16

The 16 terminals allow for versatile connectivity options in the circuit.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this clock generator suitable for compact designs.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage ensures efficient power consumption and operation in low-voltage applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range allows for operation in a wide range of temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and enhances the overall reliability of the connection.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and ease of connection.

Maximum Seated Height: 1.1 mm

The low maximum seated height ensures compatibility with slim and compact PCB designs.

Width: 4.4 mm

The 4.4mm width offers a compact form factor for seamless integration into the circuit layout.

Maximum Time At Peak Reflow Temperature (s): 20

The 20-second maximum reflow time at peak temperature ensures proper soldering and reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for robust soldering in manufacturing processes.

Length: 5 mm

The 5mm length provides a balanced form factor for easy integration into various PCB layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

The clock generator specifically designed for processors offers precise timing and synchronization capabilities.

Technology: CMOS

The CMOS technology used in this clock generator provides low power consumption and high-speed operation.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and stability during installation and operation.

Nominal Supply Voltage: 3.3 V

The nominal 3.3V supply voltage ensures compatibility with standard power requirements in electronic systems.

Terminal Pitch: 0.65 mm

The 0.65mm terminal pitch allows for fine-pitch mounting, ideal for compact designs and high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this clock generator has a moderate level of moisture sensitivity during handling and storage.

Nominal Primary Clock/Crystal Frequency: 166 MHz

The 166MHz primary clock/crystal frequency offers stability and precision in generating clock signals for the system.

Technical Specifications

Clock Generators CY22393FXCT attributes and parameters. Explore more Clock Generators devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

166 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

4.4 mm

Trade Compliance

CY22393FXCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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