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CY22393FXC

Infineon Technologies

CY22393FXC by Infineon Technologies

CY22393FXC clock generator by Infineon operates at 200MHz, with a supply voltage range of 3.135V to 3.465V. It is a CMOS technology-based IC suitable for processors, featuring a small outline package with 16 terminals and matte tin finish. Ideal for commercial applications requiring precise clock generation in compact designs.

Median Price

$18.885

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

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RS (Exports)

UK . 96 parts In-Stock

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$18.885

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Arrow

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Mouser Electronics

USA . 915 parts In-Stock

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Chip1Stop

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Rochester

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Verical

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Avnet

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Future Electronics

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$16.880

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Greenchips

USA . 543 parts In-Stock

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Bristol Electronics

USA . 1,382 parts In-Stock

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Digiode

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Component Electronics Inc.

Canada . 5 parts In-Stock

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$26.920

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$20.190

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Chip Stock

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Poland . 718 parts In-Stock

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IBS Electronics

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Atlantic Semiconductor

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Modulus Dynamics

Lithuania . 4,245 parts In-Stock

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$12.304

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$11.812

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$11.320

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Corohmni

South Africa . 663 parts In-Stock

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Corphita

USA . 589 parts In-Stock

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$14.490

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Ampacity Inc.

Singapore . 2,519 parts In-Stock

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$15.160

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Semicontronic

India . 2,363 parts In-Stock

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$15.160

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$14.781

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$14.705

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Microchip USA

USA . 1,643 parts In-Stock

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$54.376

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Aztec Data Supply Inc.

USA . 328 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

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Lixinc

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Perfect Parts

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Glotronic Ltd.

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 800 parts In-Stock

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Metaverse IC Inc.

Canada . 163 parts In-Stock

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Continental Prestige Electronics

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GreenTree Electronics

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Overview

Experience the seamless performance and reliability of the CY22393FXC Clock Generator by Infineon Technologies. Crafted with precision using high-quality materials and advanced technology, this clock generator is designed to meet your specific needs. Whether you're in the telecommunications, networking, or industrial sector, this versatile product offers unmatched value and benefits. Say goodbye to downtime and hello to efficient operations with the CY22393FXC Clock Generator. Trust in Infineon Technologies for superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 3.465 V

The higher supply voltage provides flexibility for different power requirements.

Package Shape: RECTANGULAR

The rectangular shape ensures efficient use of space on the PCB.

Maximum Output Clock Frequency: 200 MHz

High clock frequency allows for fast data processing and communication.

Power Supplies (V): 3.3

The standard power supply voltage ensures compatibility with various systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components on the board.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space and reduces overall board size.

Minimum Supply Voltage: 3.135 V

The low minimum supply voltage helps in conserving power.

Maximum Operating Temperature: 70 °C

High operating temperature range makes the product suitable for various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and design.

Maximum Seated Height: 1.1 mm

Low seated height allows for slim and compact device design.

Width: 4.4 mm

Narrow width saves space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time prevents damage to the product during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering of the terminals.

Length: 5 mm

Compact length makes it suitable for small form factor devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard operating conditions.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Designed specifically for clock generation in processor applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable operation of the device.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product can withstand standard moisture exposure.

Nominal Primary Clock/Crystal Frequency: 166 MHz

The nominal frequency output meets the requirements of many applications.

Technical Specifications

Clock Generators CY22393FXC attributes and parameters. Explore more Clock Generators devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

166 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

4.4 mm

Trade Compliance

CY22393FXC Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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