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ASM3I2598AG-06-OR

Onsemi

ASM3I2598AG-06-OR by Onsemi

ASM3I2598AG-06-OR by Onsemi is a Clock Generator with 120 MHz output frequency, operating at -40 to 85 °C. It has 6 terminals, CMOS technology, and supports supply voltage range of 2.375V to 2.625V. Ideal for industrial applications requiring precise clock generation in compact form factor.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

< 1k

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Vyrian

USA . 442 parts In-Stock

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Digiode

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Native Components

USA . 170 parts In-Stock

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$0.516

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Northwest PG Solutions

USA . 1,444 parts In-Stock

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SupplyDigital Components

Austria . 6,431 parts In-Stock

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Kulean Microsystems

USA . 4,712 parts In-Stock

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Problanco Electronics

Mexico . 3,234 parts In-Stock

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TANS Electronics

Latvia . 2,715 parts In-Stock

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Corphita

USA . 795 parts In-Stock

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Corohmni

South Africa . 386 parts In-Stock

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UHIMA Technologies

Türkiye . 104 parts In-Stock

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Overview

Elevate your electronics with the ASM3I2598AG-06-OR by Onsemi, a top-of-the-line clock generator that guarantees precision and reliability. Onsemi's reputation for quality craftsmanship shines through in this product, offering customers unparalleled performance in a compact and efficient package. Whether you're looking to enhance the functionality of your devices or streamline your operations, this clock generator is the perfect choice. Experience seamless integration, enhanced efficiency, and improved productivity with the ASM3I2598AG-06-OR by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB, making the product suitable for compact designs.

Maximum Supply Voltage: 2.625 V

The high maximum supply voltage ensures stable and reliable operation under various voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to work with, allowing for efficient PCB layout and integration.

Maximum Output Clock Frequency: 120 MHz

High maximum output clock frequency of 120 MHz supports fast and accurate timing for applications that require precise synchronization.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting to other components and peripherals, enhancing the product's functionality.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB and allows for a compact overall design.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage enables the product to operate efficiently even at lower power levels, saving energy.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand elevated temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments, increasing its versatility.

Terminal Position: DUAL

Dual terminal positions provide redundancy and improve connectivity, enhancing the product's reliability.

Maximum Seated Height: 1 mm

The low maximum seated height helps maintain a slim profile and reduces the overall size of the product, making it ideal for compact designs.

Width: 1.6 mm

The narrow width of 1.6 mm facilitates easy placement on the PCB and allows for efficient space utilization in the design.

Length: 2.9 mm

The short length of 2.9 mm contributes to a compact form factor, enabling the product to fit into small spaces or tight layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The peripheral IC type of clock generator, among others, offers additional versatility and functionality for different applications and requirements.

Technology: CMOS

The CMOS technology used in the product results in low power consumption, high noise immunity, and compatibility with a wide range of other components.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical strength and facilitates easy soldering during assembly, ensuring a secure and reliable connection.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V is standard and commonly available, allowing for easy integration into existing systems.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95 mm enables high-density mounting and precise connections, suitable for applications with limited space.

Nominal Primary Clock/Crystal Frequency: 120 MHz

The nominal primary clock/crystal frequency of 120 MHz provides a stable and accurate reference signal for clock generation, ensuring precise timing control.

Technical Specifications

Clock Generators ASM3I2598AG-06-OR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOM SUPPLY

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

120 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Nominal Primary Clock/Crystal Frequency:

120 MHz

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

ASM3I2598AG-06-OR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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