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ASM3I2590AF-06-OR

Onsemi

ASM3I2590AF-06-OR by Onsemi

ASM3I2590AF-06-OR by Onsemi is a Clock Generator with 120 MHz output frequency, operating temperature range of -40 to 85 °C. It has 6 terminals, CMOS technology, and is ideal for industrial applications requiring precise clock generation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,201 parts In-Stock

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2,201

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Digiode

USA . 134 parts In-Stock

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134

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Distributors (Availability)

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Native Components

USA . 504 parts In-Stock

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$0.193

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$0.185

504

$0.193

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$0.185

Northwest PG Solutions

USA . 1,501 parts In-Stock

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$0.212

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$0.187

1,501

$0.212

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$0.187

SupplyDigital Components

Austria . 6,280 parts In-Stock

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6,280

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Kulean Microsystems

USA . 5,840 parts In-Stock

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5,840

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TANS Electronics

Latvia . 4,850 parts In-Stock

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4,850

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UHIMA Technologies

Türkiye . 936 parts In-Stock

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936

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Corphita

USA . 728 parts In-Stock

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Problanco Electronics

Mexico . 214 parts In-Stock

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Corohmni

South Africa . 170 parts In-Stock

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170

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Overview

Enhance the performance of your electronic devices with the ASM3I2590AF-06-OR by Onsemi. Crafted with precision and expertise, this clock generator offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures seamless operation and optimal functionality. Experience the value and benefits that this innovative device brings, providing you with a competitive edge in the market. Trust Onsemi to deliver excellence in every aspect, making the ASM3I2590AF-06-OR a worthwhile investment for your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for electronic devices.

Surface Mount: YES

Easy to install on a circuit board without the need for additional hardware.

Maximum Supply Voltage: 2.625 V

Operates efficiently within a range of common supply voltages.

Package Shape: RECTANGULAR

Sleek and compact design that fits well in tight spaces.

Maximum Output Clock Frequency: 120 MHz

Provides high-speed clock signals for various applications.

No. of Terminals: 6

Simplified connectivity with a manageable number of terminals.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Space-saving design for efficient use of PCB real estate.

Minimum Supply Voltage: 2.375 V

Operates reliably even at lower supply voltages, conserving power.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that require extended temperature ranges.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in harsh environments with low temperatures.

Terminal Position: DUAL

Facilitates easy connection and installation in a circuit.

Maximum Seated Height: 1 mm

Low profile design for enhanced space efficiency.

Width: 1.6 mm

Compact width for fitting in tight spaces on a circuit board.

Length: 2.9 mm

Short length suitable for small form factor devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Versatile clock generator with additional peripheral features.

Technology: CMOS

Efficient and low-power consumption CMOS technology.

Terminal Form: GULL WING

Easy to solder and secure connection with gull-wing terminals.

Nominal Supply Voltage: 2.5 V

Optimal operating voltage for reliable performance.

Terminal Pitch: 0.95 mm

Fine pitch terminals for precise and compact connection.

Nominal Primary Clock/Crystal Frequency: 120 MHz

High-frequency clock signal for various applications requiring precise timing.

Technical Specifications

Clock Generators ASM3I2590AF-06-OR attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT 3.3V NOM SUPPLY

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

120 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Nominal Primary Clock/Crystal Frequency:

120 MHz

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Peripheral IC Type:

Trade Compliance

ASM3I2590AF-06-OR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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