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CDCM61004RHBR/2801

Texas Instruments

CDCM61004RHBR/2801 by Texas Instruments

Texas Instruments CDCM61004RHBR/2801 is a clock generator with max output frequency of 683.264 MHz, suitable for industrial applications. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V and terminal pitch of 0.5mm. Ideal for systems requiring precise timing control in compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,165 parts In-Stock

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Digiode

USA . 754 parts In-Stock

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Nova Conductors

Japan . 82 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$9.954

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$9.058

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$8.162

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100

$9.954

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Semicontronic

India . 821 parts In-Stock

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$10.000

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$9.750

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$9.700

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$10.000

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AZTECH Wire

Italy . 669 parts In-Stock

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$19.699

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$19.699

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Ampacity Inc.

Singapore . 580 parts In-Stock

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$24.000

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$24.000

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One Stop Electronics

USA . 738 parts In-Stock

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$34.000

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$34.000

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Parana Technologies

USA . 2,368 parts In-Stock

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$72.870

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Corohmni

South Africa . 213 parts In-Stock

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$78.326

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DigiPath Technology Company

USA . 1,310 parts In-Stock

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$80.238

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ChromeModa Solutions

Germany . 2,397 parts In-Stock

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$81.876

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$67.138

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$81.876

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IDEA Electronic Components Group

UK . 793 parts In-Stock

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$81.876

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$77.782

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$73.688

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793

$81.876

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Argo Parts USA

USA . 1,902 parts In-Stock

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Corphita

USA . 1,084 parts In-Stock

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Bastille Electronics

Australia . 700 parts In-Stock

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Continental Prestige Electronics

USA . 463 parts In-Stock

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Overview

Unlock precision timing with the CDCM61004RHBR/2801 clock generator by Texas Instruments. Crafted from high-quality materials, this device delivers unmatched reliability and performance. Ideal for a wide range of applications, this clock generator provides customers with unparalleled value and benefits. Experience seamless integration, enhanced efficiency, and superior functionality with this cutting-edge product. Elevate your projects with Texas Instruments' CDCM61004RHBR/2801 clock generator today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various electronic applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort in production.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, ensuring compatibility with a wide range of power sources.

Maximum Output Clock Frequency: 683.264 MHz

High maximum output clock frequency allows for precise timing and performance in advanced electronic systems.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures, making it suitable for use in harsh environments or industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of the clock generator.

Technical Specifications

Clock Generators CDCM61004RHBR/2801 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

683.264 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Nominal Primary Clock/Crystal Frequency:

28.47 MHz

Maximum Seated Height:

1 mm

Maximum Supply Current:

215 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CDCM61004RHBR/2801 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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